5G毫米波移动设备的小尺寸宽带双极化紧耦合阵列

IF 0.6 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Electromagnetics Pub Date : 2023-05-19 DOI:10.1080/02726343.2023.2227471
Chan Bai, Shuai Zhang, Qi Gong, Zixuan Song, Yu-Guo Liu
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引用次数: 0

摘要

提出了一种适用于5g毫米波(mmW)的基于紧密耦合偶极子阵列(TCDA)的小型化双极化智能手机天线。天线单元尺寸为2.94 mm × 3.05 mm × 0.94 mm, pol-x和pol-y的VSWR分别为91.5%和88.4%。为了实现低成本,紧凑的尺寸,并减少端口的数量,一个特定的微型进料结构,使用Γ-shaped耦合探头,被应用。该智能手机天线由8个单元组成,尺寸为23.8 mm × 3.5 mm × 0.94 mm。实验表明,TCDA在5g毫米波频段内,pol-x和pol-y的最小实现增益分别为9.51 dB和9.07 dB。为了验证设计理念,制作并测量了TCDA,实现了无光栅瓣的60°扫描。测试结果表明,该天线非常适合未来的5g毫米波移动电话。
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A Wideband Dual-Polarized Tightly Coupled Array with Compact Size for 5G Millimeter-wave Mobile Devices
ABSTRACT A miniaturized dual-polarized smartphone antenna based on tightly coupled dipole array (TCDA), applying to 5 G millimeter-wave (mmW), is presented. The antenna element has a size of 2.94 mm × 3.05 mm × 0.94 mm and covers a bandwidth of 91.5% and 88.4% with VSWR<2 for pol-x and pol-y, respectively. To achieve low cost, compact size, and reduce the number of ports, a specific miniature feeding structure, using Γ-shaped coupling probes, is applied. The proposed smartphone antenna consists of eight elements with a size of 23.8 mm × 3.5 mm × 0.94 mm. Experiments show that the TCDA can support a minimum realized gain of 9.51 dB and 9.07 dB for pol-x and pol-y, respectively, within 5 G mmW bands. To verify the design concept, TCDA is fabricated and measured, which achieves 60° scanning without grating lobes. The measurement results demonstrate that the proposed antenna is well suited for future 5 G mmW mobile phones.
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来源期刊
Electromagnetics
Electromagnetics 工程技术-工程:电子与电气
CiteScore
1.60
自引率
12.50%
发文量
31
审稿时长
6 months
期刊介绍: Publishing eight times per year, Electromagnetics offers refereed papers that span the entire broad field of electromagnetics and serves as an exceptional reference source of permanent archival value. Included in this wide ranging scope of materials are developments in electromagnetic theory, high frequency techniques, antennas and randomes, arrays, numerical techniques, scattering and diffraction, materials, and printed circuits. The journal also serves as a forum for deliberations on innovations in the field. Additionally, special issues give more in-depth coverage to topics of immediate importance. All submitted manuscripts are subject to initial appraisal by the Editor, and, if found suitable for further consideration, to peer review by independent, anonymous expert referees. Submissions can be made via email or postal mail.
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