微探针在局部电沉积中的作用:电解质的局部输运和力位移灵敏度

IF 2.3 4区 工程技术 Q3 ENGINEERING, MANUFACTURING 3D Printing and Additive Manufacturing Pub Date : 2024-04-01 Epub Date: 2024-04-16 DOI:10.1089/3dp.2022.0238
Wanfei Ren, Manfei Wang, Xiaoqing Sun, Edgar Hepp, Jinkai Xu
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引用次数: 0

摘要

面对 6G 通信、长波红外超表面和仿生微流控技术的快速发展,对基于金属微小结构的微系统的性能要求逐渐提高。局部电化学沉积微添加制造技术作为制造金属复杂微结构的有力手段之一,可以在不使用掩膜和支撑材料的情况下制造出铜金属微悬浮结构。本研究对微探针悬臂(MC)在局部电沉积中的作用进行了研究。MC 可用于精确沉积,具有电解质局部传输功能和高精度的力-位移灵敏度。为了证明这一点,模拟了 MC 处于弯曲或正常状态时的电解质流动。模拟结果表明了湍流对电解质流速和金字塔末端压力的影响。结果表明,与正常状态相比,弯曲探头的内部流速增加了 8.9%。此外,本研究还分析了 MC 的力-电位灵敏度特性。以 MC 的变形为中间变量,用数学方法建立了沉积物生长引起的探针尖端位移和光电探测器显示的电压值模型。此外,还通过仿真过程模拟了单个体素的沉积,模拟高度为单个体素 520 nm,仿真结果与实验结果的吻合度为 93.1%。总之,这种方法为复杂微结构的局部电沉积提供了一种新的途径。
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The Roles of Microprobe in Localized Electrodeposition: Electrolyte Localized Transport and Force-Displacement Sensitivity.

Facing the rapid development of 6G communication, long-wave infrared metasurface and biomimetic microfluidics, the performance requirements for microsystems based on metal tiny structures are gradually increasing. As one of powerful methods for fabrication metal complex microstructures, localized electrochemical deposition microadditive manufacturing technology can fabricate copper metal micro overhanging structures without masks and supporting materials. In this study, the role of the microprobe cantilever (MC) in localized electrodeposition was studied. The MC can be used for precise deposition with electrolyte localized transport function and high accuracy force-displacement sensitivity. To prove this, the electrolyte flow was simulated when the MC was in bending or normal state. The simulation results can indicate the influence of turbulent flow on the electrolyte flow velocity and the pressure at the end of the pyramid. The results show that the internal flow velocity increased by 8.9% in the bending probe as compared with normal. Besides, this study analyzed the force-potential sensitivity characteristics of the MC. Using the deformation of the MC as an intermediate variable, the model of the probe tip displacement caused by the growth of the deposit and the voltage value displayed by the photodetector was mathematically established. In addition, the deposition of a single voxel was simulated by simulation process with the simulated height of 520 nm for one voxel, and the coincidence of simulation and experimental results was 93.1%. In conclusion, this method provides a new way for localized electrodeposition of complex microstructures.

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来源期刊
3D Printing and Additive Manufacturing
3D Printing and Additive Manufacturing Materials Science-Materials Science (miscellaneous)
CiteScore
6.00
自引率
6.50%
发文量
126
期刊介绍: 3D Printing and Additive Manufacturing is a peer-reviewed journal that provides a forum for world-class research in additive manufacturing and related technologies. The Journal explores emerging challenges and opportunities ranging from new developments of processes and materials, to new simulation and design tools, and informative applications and case studies. Novel applications in new areas, such as medicine, education, bio-printing, food printing, art and architecture, are also encouraged. The Journal addresses the important questions surrounding this powerful and growing field, including issues in policy and law, intellectual property, data standards, safety and liability, environmental impact, social, economic, and humanitarian implications, and emerging business models at the industrial and consumer scales.
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