以无环葫芦为原料的乙基香兰素热控释体系研究

IF 1.6 4区 农林科学 International Journal of Food Engineering Pub Date : 2022-05-25 DOI:10.1515/ijfe-2022-0055
G. Dong, Jiawei Zhou, Guiyuan Zhou, Pei-Yi Yin, Jing Yang, W. Lu, Chuanzhu Gao, Xiali Liao, Baoxing Wang, Bo Yang
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引用次数: 1

摘要

摘要乙基香草醛(EVA)是世界上最受欢迎的香料之一,但它不稳定,容易失去香气。通过超分子主体的主客体包封可以提高香料分子的稳定性,并赋予其优异的热控释放性能,以满足食品、化妆品和烟草等领域的要求。本文制备了两种EVA的无环葫芦脲(ACBs、M1和M2)包合物。用1H NMR、SEM、XRD、FT-IR和TGA对它们的结合行为进行了研究。化学计量比通过Job’s图为1:1,结合常数通过荧光滴定测定。用2D-ROESY NMR研究了主客体分子间的相互作用,提出了包合模式。最后,热控释实验表明,ACBs/EVA包合物在较高温度下具有较少的挥发、较长的停留时间和热控释性能。本研究为扩大EVA的应用提供了理论和技术指导。
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A heat-controlled release system of ethyl vanillin based on acyclic cucurbit[n]urils
Abstract Ethyl vanillin (EVA) is one of the most popular spices in the world, but it is unstable and is prone to lose its aroma. Host–Guest encapsulation by supramolecular hosts can improve stability of fragrance molecules and endow them with excellent heat-controlled release properties to satisfy requirements in food, cosmetic and tobacco, etc. Herein, two acyclic cucurbit[n]urils (ACBs, M1 and M2) inclusion complexes of EVA were prepared. Their binding behaviors were investigated by 1H NMR, SEM, XRD, FT-IR and TGA. The stoichiometric ratio was 1:1 by Job’s plot and the binding constant was determined by fluorescence titration. The intermolecular interaction between host and guest was studied by 2D-ROESY NMR and the inclusion mode was proposed. Finally, the heat-controlled release experiment indicated that the inclusion complexes of ACBs/EVA possess less volatilization at higher temperature, longer retention time and heat-controlled release. This study provides theoretical and technical guidance for expanding the application of EVA.
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来源期刊
International Journal of Food Engineering
International Journal of Food Engineering 农林科学-食品科技
CiteScore
3.20
自引率
0.00%
发文量
52
审稿时长
3.8 months
期刊介绍: International Journal of Food Engineering is devoted to engineering disciplines related to processing foods. The areas of interest include heat, mass transfer and fluid flow in food processing; food microstructure development and characterization; application of artificial intelligence in food engineering research and in industry; food biotechnology; and mathematical modeling and software development for food processing purposes. Authors and editors come from top engineering programs around the world: the U.S., Canada, the U.K., and Western Europe, but also South America, Asia, Africa, and the Middle East.
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