Heat treated graphene thin films for reduced void content of interlaminar enhanced CF/PEEK composites

Graphene enhanced thermoplastic composites offer the possibility of conductive aerospace structures suitable for applications from electrostatic dissipation, to lightning strike protection and heat dissipation. Spray deposition of liquid phase exfoliated (LPE) aqueous graphene suspensions are highly scalable rapid manufacturing methods suitable to automated manufacturing processes. The effects of residual surfactant and water from LPE on thin films for interlaminar prepreg composite enhancement remain unknown. This work investigates the effect of heat treatment on graphene thin films spray deposited onto carbon fibre/polyether ether ketone (CF/PEEK) composites for reduced void content. Graphene thin films deposited onto CF/PEEK prepreg tapes had an RMS roughness of 1.99 μm and an average contact angle of 11°. After heat treatment the roughness increased to 2.52 μm with an average contact angle of 82°. The SEM images, contact angle, and surface roughness measurements correlated suggesting successful removal of excess surfactant and moisture with heat treatment. Raman spectroscopy was used to characterise the chemical quality of the consolidated graphene interlayer. Spectral data concluded the graphene was 3–4 layered with predominantly edge defects suggesting high quality graphene suitable for electrical enhancement. Conductive-AFM measurements observed an increase in conductive network density in the interlaminar region after the removal of surfactant from the thin film. Heat treatment of the Control sample successfully reduced void content from 4.2 vol% to 0.4 vol%, resulting in a 149% increase in compressive shear strength. Comparatively, heat treatment of graphene enhanced samples (~ 1 wt%) reduced void content from 5.1 vol% to 2.8 vol%. Although a 25% reduction in shear strength was measured, the improved electrical conductivity of the interlaminar region extends the potential applications of fibre reinforced thermoplastic composites. The heat treatment process proves effective in reducing surfactant and thus void content while improving electrical conductivity of the interlayer in a scalable manner. Further investigations into graphene loading effects on conductive enhancement, and void formation is needed.