Design and implementation of a remote monitoring system of mold cavity using eject pin in high-pressure die casting

ABSTRACT This research presents a design process for mould cavity monitoring with a temperature and force-generated pressure measurement system in high-pressure Die casting (HPDC). K-type thermocouple sensor was selected to measure the harsh environment of the Mould Cavity. An eject pin was processed and used for the installation of the sensor in the measurement system, and data was collected from the sensor and displayed as a real-time graph. The rationality of the obtained data was verified with comparative analysis with finite element analysis simulation (FEM) result as a reverse engineering approach. The proposed system is successfully measuring and monitoring the temperature and pressure inside the mould, allowing for the safe monitoring of Die casting. Through monitoring, abnormal conditions in the process can be detected. It is expected that this will reduce the defect rate and improve the quality of manufactured products.