从软化聚合物到基于多种材料的生物电子设备

Q1 Materials Science Multifunctional Materials Pub Date : 2018-12-11 DOI:10.1088/2399-7532/aaed58
M. Ecker, A. Joshi-Imre, R. Modi, C. Frewin, Aldo Garcia-Sandoval, Jimin Maeng, G. Gutierrez-Heredia, J. Pancrazio, W. Voit
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引用次数: 23

摘要

生物电子器件的最新发展涉及使用多功能聚合物作为基底材料。薄膜聚合物动态软化,减少了植入后设备和组织之间的机械失配,从而改善了设备与组织的相互作用。然而,当将一种新材料用于制造功能齐全且长期可行的器件时,需要解决一些具体的挑战。所有多材料器件的关键是确保不同层之间具有良好的粘附性和连接性。如果其中一种材料对温度和湿度等刺激敏感,情况尤其如此。这篇综述将概述以软化形状记忆聚合物(SMPs)为基底材料的用于记录和刺激的各种神经界面的开发。这篇综述讨论了器件制造、测试和耐久性的具体要求。
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From softening polymers to multimaterial based bioelectronic devices
A recent development in bioelectronic devices involves the utilization of multifunctional polymers as substrate material. Dynamically softening, thin-film polymers reduce the mechanical mismatch between device and tissue after implantation and therefore improves the device–tissue interaction. However, when implementing a new material into the fabrication of fully functional and chronically viable devices, there are specific challenges that need to be addressed. The key for all multimaterial devices is to ensure a good adhesion and connectivity between the different layers. That is especially true if one of the materials is sensitive to stimuli such as temperature and moisture. This review will give an overview on the development of a variety of neural interfaces for recording and stimulation with softening shape memory polymers (SMPs) as substrate material. This review discusses specific requirements for device fabrication, testing, and durability.
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来源期刊
Multifunctional Materials
Multifunctional Materials Materials Science-Materials Science (miscellaneous)
CiteScore
12.80
自引率
0.00%
发文量
9
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