{"title":"X射线:通过发出内存命令发现DRAM内部结构和错误特征","authors":"Hwayong Nam;Seungmin Baek;Minbok Wi;Michael Jaemin Kim;Jaehyun Park;Chihun Song;Nam Sung Kim;Jung Ho Ahn","doi":"10.1109/LCA.2023.3296153","DOIUrl":null,"url":null,"abstract":"The demand for accurate information about the internal structure and characteristics of DRAM has been on the rise. Recent studies have explored the structure and characteristics of DRAM to improve processing in memory, enhance reliability, and mitigate a vulnerability known as rowhammer. However, DRAM manufacturers only disclose limited information through official documents, making it difficult to find specific information about actual DRAM devices. This paper presents reliable findings on the internal structure and characteristics of DRAM using activate-induced bitflips (AIBs), retention time test, and row-copy operation. While previous studies have attempted to understand the internal behaviors of DRAM devices, they have only shown results without identifying the causes or have analyzed DRAM modules rather than individual chips. We first uncover the size, structure, and operation of DRAM subarrays and verify our findings on the characteristics of DRAM. Then, we correct misunderstood information related to AIBs and demonstrate experimental results supporting the cause of rowhammer.","PeriodicalId":51248,"journal":{"name":"IEEE Computer Architecture Letters","volume":"22 2","pages":"89-92"},"PeriodicalIF":1.4000,"publicationDate":"2023-07-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"X-ray: Discovering DRAM Internal Structure and Error Characteristics by Issuing Memory Commands\",\"authors\":\"Hwayong Nam;Seungmin Baek;Minbok Wi;Michael Jaemin Kim;Jaehyun Park;Chihun Song;Nam Sung Kim;Jung Ho Ahn\",\"doi\":\"10.1109/LCA.2023.3296153\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The demand for accurate information about the internal structure and characteristics of DRAM has been on the rise. Recent studies have explored the structure and characteristics of DRAM to improve processing in memory, enhance reliability, and mitigate a vulnerability known as rowhammer. However, DRAM manufacturers only disclose limited information through official documents, making it difficult to find specific information about actual DRAM devices. This paper presents reliable findings on the internal structure and characteristics of DRAM using activate-induced bitflips (AIBs), retention time test, and row-copy operation. While previous studies have attempted to understand the internal behaviors of DRAM devices, they have only shown results without identifying the causes or have analyzed DRAM modules rather than individual chips. We first uncover the size, structure, and operation of DRAM subarrays and verify our findings on the characteristics of DRAM. Then, we correct misunderstood information related to AIBs and demonstrate experimental results supporting the cause of rowhammer.\",\"PeriodicalId\":51248,\"journal\":{\"name\":\"IEEE Computer Architecture Letters\",\"volume\":\"22 2\",\"pages\":\"89-92\"},\"PeriodicalIF\":1.4000,\"publicationDate\":\"2023-07-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Computer Architecture Letters\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10185054/\",\"RegionNum\":3,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Computer Architecture Letters","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10185054/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
X-ray: Discovering DRAM Internal Structure and Error Characteristics by Issuing Memory Commands
The demand for accurate information about the internal structure and characteristics of DRAM has been on the rise. Recent studies have explored the structure and characteristics of DRAM to improve processing in memory, enhance reliability, and mitigate a vulnerability known as rowhammer. However, DRAM manufacturers only disclose limited information through official documents, making it difficult to find specific information about actual DRAM devices. This paper presents reliable findings on the internal structure and characteristics of DRAM using activate-induced bitflips (AIBs), retention time test, and row-copy operation. While previous studies have attempted to understand the internal behaviors of DRAM devices, they have only shown results without identifying the causes or have analyzed DRAM modules rather than individual chips. We first uncover the size, structure, and operation of DRAM subarrays and verify our findings on the characteristics of DRAM. Then, we correct misunderstood information related to AIBs and demonstrate experimental results supporting the cause of rowhammer.
期刊介绍:
IEEE Computer Architecture Letters is a rigorously peer-reviewed forum for publishing early, high-impact results in the areas of uni- and multiprocessor computer systems, computer architecture, microarchitecture, workload characterization, performance evaluation and simulation techniques, and power-aware computing. Submissions are welcomed on any topic in computer architecture, especially but not limited to: microprocessor and multiprocessor systems, microarchitecture and ILP processors, workload characterization, performance evaluation and simulation techniques, compiler-hardware and operating system-hardware interactions, interconnect architectures, memory and cache systems, power and thermal issues at the architecture level, I/O architectures and techniques, independent validation of previously published results, analysis of unsuccessful techniques, domain-specific processor architectures (e.g., embedded, graphics, network, etc.), real-time and high-availability architectures, reconfigurable systems.