具有谐波的广义热微拉伸弹性固体I型裂纹问题

Pub Date : 2023-07-20 DOI:10.24425/ATHER.2020.133626
K. Lotfy, A. El-Bary, M. Allan, M. H. Ahmed
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引用次数: 2

摘要

求解了由有限线性开口I型裂纹削弱的有限空间的广义热微拉伸方程的一般模型。考虑的材料是均匀各向同性弹性半空间。裂纹受到规定的温度和应力分布的影响。该公式应用于广义热弹性理论,使用Lord-Şhulman(涉及一个弛豫时间)和Green-Lindsay(包括两个弛豫次数)理论的数学分析,相对于经典动力耦合理论(CD)。利用谐波方法得到了法向位移、法向应力、耦合应力、微应力和温度分布的精确表达式。所考虑的场地随水平距离的变化以图形方式进行了解释。还对这三种理论进行了比较,并对铜晶体的不同深度进行了比较。
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Generalized thermal microstretch elastic solid with harmonic wave for mode-I crack problem
A general model of the equations of generalized thermo-micro-stretch for an infinite space weakened by a finite linear opening mode-I crack is solved. Considered material is the homogeneous isotropic elastic half space. The crack is subjected to a prescribed temperature and stress distribution. The formulation is applied to generalized thermoelasticity theories, using mathematical analysis with the purview of the Lord-Şhulman (involving one relaxation time) and Green-Lindsay (includes two relaxation times) theories with respect to the classical dynamical coupled theory (CD). The harmonic wave method has been used to obtain the exact expression for normal displacement, normal stress force, coupled stresses, microstress and temperature distribution. Variations of the considered fields with the horizontal distance are explained graphically. A comparison is also made between the three theories and for different depths for the case of copper crystal.
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