硅的调试和诊断[来自EIC]

A. Ivanov
{"title":"硅的调试和诊断[来自EIC]","authors":"A. Ivanov","doi":"10.1109/MDAT.2013.2283588","DOIUrl":null,"url":null,"abstract":"The Editor-in-Cheif is pleased to present this July-August issue, which brings you a combination of articles that cover a rich set of academic and industrial work addressing state-of-the-art issues of design, verification, and test of different IC-based systems represented at different levels of abstraction. The figure of merit for the different approaches varies, depending on the specific case, but are generally variations of cost, performance, quality, yield, and feasibility. An overview of each of the technical articles and features is presented.","PeriodicalId":50392,"journal":{"name":"IEEE Design & Test of Computers","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2013-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/MDAT.2013.2283588","citationCount":"0","resultStr":"{\"title\":\"A look at silicon debug and diagnosis [From the EIC]\",\"authors\":\"A. Ivanov\",\"doi\":\"10.1109/MDAT.2013.2283588\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Editor-in-Cheif is pleased to present this July-August issue, which brings you a combination of articles that cover a rich set of academic and industrial work addressing state-of-the-art issues of design, verification, and test of different IC-based systems represented at different levels of abstraction. The figure of merit for the different approaches varies, depending on the specific case, but are generally variations of cost, performance, quality, yield, and feasibility. An overview of each of the technical articles and features is presented.\",\"PeriodicalId\":50392,\"journal\":{\"name\":\"IEEE Design & Test of Computers\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1109/MDAT.2013.2283588\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Design & Test of Computers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MDAT.2013.2283588\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Design & Test of Computers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MDAT.2013.2283588","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

主编很高兴为您呈现这一期7 - 8月刊,它为您带来了一系列文章,涵盖了丰富的学术和工业工作,解决了在不同抽象层次上表示的不同基于ic的系统的设计、验证和测试的最新问题。根据具体情况,不同方法的优点有所不同,但通常是成本、性能、质量、产量和可行性的变化。介绍了每篇技术文章和特性的概述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A look at silicon debug and diagnosis [From the EIC]
The Editor-in-Cheif is pleased to present this July-August issue, which brings you a combination of articles that cover a rich set of academic and industrial work addressing state-of-the-art issues of design, verification, and test of different IC-based systems represented at different levels of abstraction. The figure of merit for the different approaches varies, depending on the specific case, but are generally variations of cost, performance, quality, yield, and feasibility. An overview of each of the technical articles and features is presented.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
IEEE Design & Test of Computers
IEEE Design & Test of Computers 工程技术-工程:电子与电气
自引率
0.00%
发文量
1
审稿时长
>12 weeks
期刊最新文献
Message From the Steering Committee Conference reports Conference Reports Conference Reports Editorial Calendar
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1