OpenDFM弥合DRC和DFM之间的差距

J. Buurma, R. Sayah, F. Valente, C. Rodgers
{"title":"OpenDFM弥合DRC和DFM之间的差距","authors":"J. Buurma, R. Sayah, F. Valente, C. Rodgers","doi":"10.1109/MDT.2012.2210380","DOIUrl":null,"url":null,"abstract":"This paper presents the details of a standard, named OpenDFM, which describes an efficient method to ensure manufacturability of integrated circuits that are designed at advanced technology nodes of today and one that can scale to address similar issues at future nodes as well. OpenDFM uses a meta-language format to capture and improve critical patterns that must be tested to ensure correct manufacturing and thus enhance yield.","PeriodicalId":50392,"journal":{"name":"IEEE Design & Test of Computers","volume":"29 1","pages":"84-90"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/MDT.2012.2210380","citationCount":"1","resultStr":"{\"title\":\"OpenDFM Bridging the Gap Between DRC and DFM\",\"authors\":\"J. Buurma, R. Sayah, F. Valente, C. Rodgers\",\"doi\":\"10.1109/MDT.2012.2210380\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the details of a standard, named OpenDFM, which describes an efficient method to ensure manufacturability of integrated circuits that are designed at advanced technology nodes of today and one that can scale to address similar issues at future nodes as well. OpenDFM uses a meta-language format to capture and improve critical patterns that must be tested to ensure correct manufacturing and thus enhance yield.\",\"PeriodicalId\":50392,\"journal\":{\"name\":\"IEEE Design & Test of Computers\",\"volume\":\"29 1\",\"pages\":\"84-90\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1109/MDT.2012.2210380\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Design & Test of Computers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MDT.2012.2210380\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Design & Test of Computers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MDT.2012.2210380","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文介绍了一个名为OpenDFM的标准的细节,该标准描述了一种有效的方法,以确保集成电路的可制造性,这些集成电路是在当今先进的技术节点上设计的,并且可以扩展到未来节点上解决类似问题。OpenDFM使用元语言格式来捕获和改进必须经过测试的关键模式,以确保正确的制造,从而提高产量。
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OpenDFM Bridging the Gap Between DRC and DFM
This paper presents the details of a standard, named OpenDFM, which describes an efficient method to ensure manufacturability of integrated circuits that are designed at advanced technology nodes of today and one that can scale to address similar issues at future nodes as well. OpenDFM uses a meta-language format to capture and improve critical patterns that must be tested to ensure correct manufacturing and thus enhance yield.
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来源期刊
IEEE Design & Test of Computers
IEEE Design & Test of Computers 工程技术-工程:电子与电气
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