客座编辑介绍:智能硅的片上结构

IEEE Design & Test of Computers Pub Date : 2012-10-01 DOI:10.1109/MDT.2012.2212533

M. Tehranipoor, L. Winemberg

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引用次数: 0

摘要

本专题介绍了用于监测电路老化和变化的新型片上结构，分析电路运行条件对老化和性能下降的影响，老化感知功率/性能调整，SerDes的互操作性和优化，最后使用片上功率监视器检测集成电路中的硬件木马。五篇论文被选在这期特刊上发表。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Guest Editors' introduction: On-chip structures for smarter silicon

This special issue presents novel on-chip structures for monitoring aging and variations in the circuit, analyzing circuit operation condition's impact on aging and performance degradation, agingaware power/performance tuning, interoperability and optimization for SerDes, and finally using onchip power monitors for detection of hardware Trojans in integrated circuits. Five papers were selected for publication in this special issue.

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