新型电子封装水泥陶瓷封装材料

IF 0.5 4区 材料科学 Q4 MATERIALS SCIENCE, CERAMICS Journal of Ceramic Science and Technology Pub Date : 2018-01-01 DOI:10.15496/PUBLIKATION-31007
Stefan Käßner, Nadja Wichtner, C. Berthold, K. Nickel
{"title":"新型电子封装水泥陶瓷封装材料","authors":"Stefan Käßner, Nadja Wichtner, C. Berthold, K. Nickel","doi":"10.15496/PUBLIKATION-31007","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":48807,"journal":{"name":"Journal of Ceramic Science and Technology","volume":null,"pages":null},"PeriodicalIF":0.5000,"publicationDate":"2018-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Novel Cement-Ceramic Encapsulation Material for Electronic Packaging\",\"authors\":\"Stefan Käßner, Nadja Wichtner, C. Berthold, K. Nickel\",\"doi\":\"10.15496/PUBLIKATION-31007\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":48807,\"journal\":{\"name\":\"Journal of Ceramic Science and Technology\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.5000,\"publicationDate\":\"2018-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Ceramic Science and Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.15496/PUBLIKATION-31007\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"MATERIALS SCIENCE, CERAMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Ceramic Science and Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.15496/PUBLIKATION-31007","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
引用次数: 7
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Novel Cement-Ceramic Encapsulation Material for Electronic Packaging
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Ceramic Science and Technology
Journal of Ceramic Science and Technology MATERIALS SCIENCE, CERAMICS-
CiteScore
0.80
自引率
0.00%
发文量
0
期刊介绍: The Journal of Ceramic Science and Technology publishes original scientific articles on all topics of ceramic science and technology from all ceramic branches. The focus is on the scientific exploration of the relationships between processing, microstructure and properties of sintered ceramic materials as well as on new processing routes for innovative ceramic materials. The papers may have either theoretical or experimental background. A high quality of publications will be guaranteed by a thorough double blind peer review process.
期刊最新文献
Circuit-Board-Integrated Transformers Design and Manufacture Avoiding Thermal-Stress-Induced Failures by Design Optimization when Brazing Perlucor® to Inconel® 718 Components Structure Features and Properties of Graphene/Al 2 O 3 Composite Improving optical transmission of spark-plasma-sintered yag ceramics: Effect of powder conditioning and post-treatments Novel Cement-Ceramic Encapsulation Material for Electronic Packaging
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1