铜电积平滑剂的检验。第一部分:综述

Q2 Materials Science Minerals & Metallurgical Processing Pub Date : 2016-02-01 DOI:10.19150/MMP.6462
M. Moats, A. Luyima, W. Cui
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引用次数: 10

摘要

有机平滑添加剂用于铜电积生产致密、厚实、高质量的阴极。传统上使用胶水,在不使用溶剂萃取来生产电积电解质的操作中仍然使用胶水。随着溶剂萃取-电积技术的出现,瓜尔胶因不影响溶剂萃取的相分离而开始被使用,并持续使用多年。然而,最近瓜尔胶已经被更便宜的糖和聚丙烯酰胺添加剂所取代。本文是研究糖和聚丙烯酰胺作为电积铜新添加剂的四篇系列论文中的第一篇。本文综述了以往有关铜电积添加剂的研究,并对其他铜电沉积系统中的添加剂进行了综述。
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Examination of copper electrowinning smoothing agents. Part I: A review
Organic smoothing additives are used to produce dense, thick, high-quality cathodes in copper electrowinning. Glue had been used traditionally and is still used in operations that do not employ solvent extraction to produce the electrowinning electrolyte. With the advent of solvent extraction–electrowinning, guar started to be used and remained in use for many years as it does not affect the phase disengagement in solvent extraction. Recently, however, guar has been replaced by less-expensive saccharide- and polyacrylamide-based additives. This paper is the first of a series of four papers that examine saccharides and polyacrylamides as new additives for copper electrowinning. A review of previous research related to copper electrowinning additives is presented here, along with a selected review of additives in other copper electrodeposition systems.
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来源期刊
Minerals & Metallurgical Processing
Minerals & Metallurgical Processing 工程技术-矿业与矿物加工
CiteScore
0.84
自引率
0.00%
发文量
0
审稿时长
>12 weeks
期刊介绍: For over twenty-five years, M&MP has been your source for the newest thinking in the processing of minerals and metals. We cover the latest developments in a wide range of applicable disciplines, from metallurgy to computer science to environmental engineering. Our authors, experts from industry, academia and the government, present state-of-the-art research from around the globe.
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