{"title":"玻璃或聚酰亚胺基板上金微加热器厚度及界面热阻分析","authors":"H. Kim, Woong Ko, D. Oh","doi":"10.32908/hthp.v50.1073","DOIUrl":null,"url":null,"abstract":"The 3ω method is widely used for measuring the thermal properties of a substrate or thin film on which a microheater is deposited. Recently, samples with non-formal shapes and has a thermal conductivity of 1 W/mK or below have been analyzed using the bidirectional 3ω method. In measuring the thermal conductivity of such samples, the measurement sensitivity and accuracy can be increased using a 3ω sensor fabricated on a low thermal conductivity substrate such as glass or polyimide. In this study, thermal characterization is conducted on a microheater deposited on glass and polyimide substrates for a 3ω sensor. The effects of the microheater thickness and the interfacial thermal resistance between the substrate and microheater, on the temperature amplitude and phase lag are analyzed. Results from analytic solutions considering the microheater thickness and the interfacial thermal resistance are compared with results from numerical analysis of two-dimensional conduction heat transfer and experiment.","PeriodicalId":12983,"journal":{"name":"High Temperatures-high Pressures","volume":null,"pages":null},"PeriodicalIF":1.1000,"publicationDate":"2021-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Analysis of thickness and interfacial thermal resistance of Au microheater on glass or polyimide substrate\",\"authors\":\"H. Kim, Woong Ko, D. Oh\",\"doi\":\"10.32908/hthp.v50.1073\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The 3ω method is widely used for measuring the thermal properties of a substrate or thin film on which a microheater is deposited. Recently, samples with non-formal shapes and has a thermal conductivity of 1 W/mK or below have been analyzed using the bidirectional 3ω method. In measuring the thermal conductivity of such samples, the measurement sensitivity and accuracy can be increased using a 3ω sensor fabricated on a low thermal conductivity substrate such as glass or polyimide. In this study, thermal characterization is conducted on a microheater deposited on glass and polyimide substrates for a 3ω sensor. The effects of the microheater thickness and the interfacial thermal resistance between the substrate and microheater, on the temperature amplitude and phase lag are analyzed. Results from analytic solutions considering the microheater thickness and the interfacial thermal resistance are compared with results from numerical analysis of two-dimensional conduction heat transfer and experiment.\",\"PeriodicalId\":12983,\"journal\":{\"name\":\"High Temperatures-high Pressures\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.1000,\"publicationDate\":\"2021-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"High Temperatures-high Pressures\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.32908/hthp.v50.1073\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"High Temperatures-high Pressures","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.32908/hthp.v50.1073","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
Analysis of thickness and interfacial thermal resistance of Au microheater on glass or polyimide substrate
The 3ω method is widely used for measuring the thermal properties of a substrate or thin film on which a microheater is deposited. Recently, samples with non-formal shapes and has a thermal conductivity of 1 W/mK or below have been analyzed using the bidirectional 3ω method. In measuring the thermal conductivity of such samples, the measurement sensitivity and accuracy can be increased using a 3ω sensor fabricated on a low thermal conductivity substrate such as glass or polyimide. In this study, thermal characterization is conducted on a microheater deposited on glass and polyimide substrates for a 3ω sensor. The effects of the microheater thickness and the interfacial thermal resistance between the substrate and microheater, on the temperature amplitude and phase lag are analyzed. Results from analytic solutions considering the microheater thickness and the interfacial thermal resistance are compared with results from numerical analysis of two-dimensional conduction heat transfer and experiment.
期刊介绍：
High Temperatures – High Pressures (HTHP) is an international journal publishing original peer-reviewed papers devoted to experimental and theoretical studies on thermophysical properties of matter, as well as experimental and modelling solutions for applications where control of thermophysical properties is critical, e.g. additive manufacturing. These studies deal with thermodynamic, thermal, and mechanical behaviour of materials, including transport and radiative properties. The journal provides a platform for disseminating knowledge of thermophysical properties, their measurement, their applications, equipment and techniques. HTHP covers the thermophysical properties of gases, liquids, and solids at all temperatures and under all physical conditions, with special emphasis on matter and applications under extreme conditions, e.g. high temperatures and high pressures. Additionally, HTHP publishes authoritative reviews of advances in thermophysics research, critical compilations of existing data, new technology, and industrial applications, plus book reviews.
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