接触压力对层状金属板热传导的影响

IF 1.1 4区 工程技术 Q4 Engineering High Temperatures-high Pressures Pub Date : 2022-01-01 DOI:10.32908/hthp.v51.1107
T. Matsushita, I. Belov, A. Johansson, A. Jarfors
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引用次数: 3

摘要

为了优化铝卷的退火工艺,经常对该工艺进行模拟。为了更高的精度模拟过程,需要可靠的输入参数,热导率(热接触导率)就是其中之一。本文提出了一种基于稳态比较纵向热流的金属薄板热导率和接触热导率测量方法。该仪器配有压缩试验机,因此它可以控制样品的压力,并在不同的接触压力下进行测量。配备的加热器允许将样品加热到573 K。为了评估界面处的热导率,采用了热阻网络模型。测量是用铝合金(AA3003板材)进行的。除了热接触电导测量外,还研究了薄片的表面粗糙度。根据测量结果,得到了接触热导率与接触压力关系的半经验方程。
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Influence of contact pressure on the thermal contact conductance of layered metallic sheets
For the optimisation of the annealing process of aluminium coils, simulation of the process is often performed. To simulate the process with higher accuracy, reliable input parameters are required, and thermal conductivity (thermal contact conductance) is one of them. In the present study, a method to measure the thermal conductivity and thermal contact conductance of metallic sheets were developed based on the steady-state comparative longitudinal heat flow. The apparatus was built with a compression test machine, and thus it allows to control the pressure to the sample and carry out the measurements at different contact pressure. An equipped heater allows to heat the sample to 573 K. To evaluate the thermal conductance at the interface, a thermal resistance network model was applied. The measurements were carried out with an aluminium alloy (AA3003 sheets). In addition to the thermal contact conductance measurements, the surface roughness of the sheets was also investigated. The semi-empirical equation for the relationship between thermal contact conductance and contact pressure was obtained based on the measurement results.
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来源期刊
High Temperatures-high Pressures
High Temperatures-high Pressures THERMODYNAMICS-MECHANICS
CiteScore
1.00
自引率
9.10%
发文量
6
期刊介绍: High Temperatures – High Pressures (HTHP) is an international journal publishing original peer-reviewed papers devoted to experimental and theoretical studies on thermophysical properties of matter, as well as experimental and modelling solutions for applications where control of thermophysical properties is critical, e.g. additive manufacturing. These studies deal with thermodynamic, thermal, and mechanical behaviour of materials, including transport and radiative properties. The journal provides a platform for disseminating knowledge of thermophysical properties, their measurement, their applications, equipment and techniques. HTHP covers the thermophysical properties of gases, liquids, and solids at all temperatures and under all physical conditions, with special emphasis on matter and applications under extreme conditions, e.g. high temperatures and high pressures. Additionally, HTHP publishes authoritative reviews of advances in thermophysics research, critical compilations of existing data, new technology, and industrial applications, plus book reviews.
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