富铜Cu76Ti24合金熔体原子动力学与过量体积的关系

IF 1.1 4区 工程技术 Q4 Engineering High Temperatures-high Pressures Pub Date : 2023-01-01 DOI:10.32908/hthp.v52.1353
L. P. Kreuzer, Fan Yang, S. Szabó, Z. Evenson, A. Meyer, W. Petry
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引用次数: 0

摘要

利用准弹性中子散射技术研究了富cu Cu76Ti24合金在1223k和1453k之间的原子动力学。得到的Cu/Ti平均自扩散系数D表现出类似阿伦尼乌斯的温度依赖性,活化能为0.46 ~ 0.02 eV /原子。在一定温度下,与纯元素相比,D比纯Cu慢,但与纯Ti相似。在大多数二元合金体系中,已经观察到这种合金化过程中液体动力学的减慢。然而,在本研究中,Cu-Ti合金的填充分数低于纯元素,这可以解释为Cu-Ti体系的正过剩体积。因此,原子动力学的组分依赖性不能与宏观堆积论证联系起来。只是,原子动力学与熔体平均堆积分数的增加无关。
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Relationship of the atomic dynamics and excess volume of a copper rich Cu76Ti24 alloy melt
We investigate the atomic dynamics of a Cu-rich Cu76Ti24 alloy between 1223 K and 1453 K using the quasi-elastic neutron scattering technique. The obtained mean Cu/Ti self-diffusion coefficient D exhibits an Arrhenius-like temperature dependence with an activation energy of 0.46�0.02 eV per atom. Compared with those of the pure elements at a given temperature, D is slower than that for pure Cu, but similar to pure Ti. This slowing down of the liquid dynamics upon alloying has been observed for most binary alloy systems. However, in this study, the packing fraction of the Cu-Ti alloy is lower than that of the pure elements, which can be explained by the positive excess volume of the Cu-Ti system. Therefore, the compositional dependence of the atomic dynamics cannot be linked to a macroscopic packing argument. Only, the atomic dynamics is not correlated with an increase of the average packing fraction of the melt.
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来源期刊
High Temperatures-high Pressures
High Temperatures-high Pressures THERMODYNAMICS-MECHANICS
CiteScore
1.00
自引率
9.10%
发文量
6
期刊介绍: High Temperatures – High Pressures (HTHP) is an international journal publishing original peer-reviewed papers devoted to experimental and theoretical studies on thermophysical properties of matter, as well as experimental and modelling solutions for applications where control of thermophysical properties is critical, e.g. additive manufacturing. These studies deal with thermodynamic, thermal, and mechanical behaviour of materials, including transport and radiative properties. The journal provides a platform for disseminating knowledge of thermophysical properties, their measurement, their applications, equipment and techniques. HTHP covers the thermophysical properties of gases, liquids, and solids at all temperatures and under all physical conditions, with special emphasis on matter and applications under extreme conditions, e.g. high temperatures and high pressures. Additionally, HTHP publishes authoritative reviews of advances in thermophysics research, critical compilations of existing data, new technology, and industrial applications, plus book reviews.
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