L. J. Su, Jo Yeji, 이현화, Kong Mi Seon, Kang Donghwa, Jung Mee Suk
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引用次数: 1
摘要
最近，为实现电子产品的小型化及高性能，需要内置的半导体及PCB的高集成化，因此，对PCB、PDP、主帧等微细模式的研究非常活跃。为了半导体、PCB的小型化及固执化，有必要缩小构成芯片的单位元件的大小，并将电路模式进行微型化。虽然有多种体现微细图案的方法，但其中受photo lithography工程的影响较大。光老化光是在覆盖半导体晶片表面的薄感光性物质上转录口罩图案的工程。在这样的工程中，为了半导体的微细工程化，正在向提高老光装备的海力，将线幅最小化的方向开发光源。特别是光源的波长越短，分辨率就越高，可以形成细微的电路模式，因此为了半导体的固执化，需要UV (ultra violet)等短波长的光源。基本上，光老化有两种方法，一种是图像打印，另一种是投影打印。其中，影像印刷分为直接接触口罩和晶片的接触印刷和非常接近的近距离印刷。其中近距离印刷在口罩和晶片之间的物理A Study of Lens Design Technique for Proximity Exposure Using A UVA LED，如图1所示
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