通过广泛的基准调查了解热互连

Yuke Li , Hao Qi , Gang Lu , Feng Jin , Yanfei Guo , Xiaoyi Lu
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引用次数: 3

摘要

了解现代数据中心和高性能计算(HPC)集群上热互连的设计和性能特征是近年来富有成果的研究课题。各种类型的数据中心和HPC应用程序(如大数据、深度学习和微服务)的高带宽和低延迟通信需求的快速持续增长,推动了先进互连设计的发展。我们认为,现在是研究具有不同基准的代表性热互连的性能特征的时候了。因此,本文对数据中心和HPC集群上最先进的热互连以及相关的代表性基准进行了广泛的调查,以帮助社区更好地理解现代互连。此外,我们通过不同应用场景下的相关基准来描述这些互连。我们根据我们的调查、实验和结果,提供了我们对数据中心互连基准测试的看法。
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Understanding hot interconnects with an extensive benchmark survey

Understanding the designs and performance characterizations of hot interconnects on modern data center and high-performance computing (HPC) clusters is a fruitful research topic in recent years. The rapid and continuous growth of high-bandwidth and low-latency communication requirements for various types of data center and HPC applications (such as big data, deep learning, and microservices) has been pushing the envelope of advanced interconnect designs. We believe this is high time to investigate the performance characterizations of representative hot interconnects with different benchmarks. Hence, this paper presents an extensive survey of state-of-the-art hot interconnects on data center and HPC clusters and the associated representative benchmarks to help the community to better understand modern interconnects. In addition, we characterize these interconnects by the related benchmarks under different application scenarios. We provide our perspectives on benchmarking data center interconnects based on our survey, experiments, and results.

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