模拟热冲击后薄板的应力-应变状态

Int. J. Model. Simul. Sci. Comput. Pub Date : 2021-11-29 DOI:10.1142/s1793962322500246

A. Sedelnikov, S. Glushkov, V. Serdakova, M. Evtushenko, E. Khnyryova

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摘要

本文致力于在ANSYS软件包中模拟热冲击对薄板的影响。对板的应力应变状态进行了评估，确定了板的温度场的动态变化。所得结果与其他作者的数据进行了比较，可用于考虑航天器大弹性元件的热冲击。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Simulating the stress-strain state of a thin plate after a thermal shock

The paper is devoted to simulating the impact of a thermal shock on a thin homogeneous plate in the ANSYS package. The assessment of the stress–strain state is carried out and the dynamics of changes in the temperature field of the plate is determined. The obtained results were compared with the data of other authors and can be used when taking into account the thermal shock of large elastic elements of spacecraft.

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Int. J. Model. Simul. Sci. Comput.

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