Sn-Bi-Ag-In无铅焊料的焊粉尺寸对Cu衬底润湿性和微观结构的影响

{"title":"Sn-Bi-Ag-In无铅焊料的焊粉尺寸对Cu衬底润湿性和微观结构的影响","authors":"Tianhan Hu, Z. Li, Guanzhi Wu, Shun Li, Kai Ding, Yulai Gao","doi":"10.1520/mpc20230003","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":18234,"journal":{"name":"Materials Performance and Characterization","volume":"63 1","pages":""},"PeriodicalIF":0.6000,"publicationDate":"2023-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate\",\"authors\":\"Tianhan Hu, Z. Li, Guanzhi Wu, Shun Li, Kai Ding, Yulai Gao\",\"doi\":\"10.1520/mpc20230003\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":18234,\"journal\":{\"name\":\"Materials Performance and Characterization\",\"volume\":\"63 1\",\"pages\":\"\"},\"PeriodicalIF\":0.6000,\"publicationDate\":\"2023-06-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Performance and Characterization\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1520/mpc20230003\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Performance and Characterization","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1520/mpc20230003","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}