半导体内部三维加工激光能量的超高时空局域化

Andong Wang, Patrick Salter, D. Grojo, Martin Booth
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引用次数: 0

摘要

半导体器件的3D制造对于从集成微电子/光子学到微机电系统(MEMS)的许多先进应用都很重要。直接激光书写创造了一种有前途的替代光刻方法,光刻方法需要繁琐的步骤。这依赖于用红外光谱区域的超短激光脉冲穿透材料内部以精确诱导微/纳米级结构的可能性。然而,最近的研究[1]-[3]显示出半导体的严重困难。窄的带隙和大的非线性折射率对可实现的聚焦条件有很强的限制,再加上重要的非线性传播效应,阻碍了精确可控制造[3]所需的高时空能量局域化。因此,监测和优化半导体内部的应用激光条件以实现高质量的3D制造是一个强烈的动机。
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Ultra-High Space-Time Localization of Laser Energy for 3D Fabrication Inside Semiconductors
3D fabrication of semiconductor devices is important for numerous advanced applications from integrated microelectronics/photonics to micro-electro-mechanical systems (MEMS). Direct laser writing creates a promising alternative to lithographic methods which can require tedious steps. This relies on the possibility to penetrate inside the materials with ultrashort laser pulses in the infrared region of the spectrum to precisely induce micro/nano-scale structures. However, recent research [1]–[3] shows severe difficulties specific to semiconductors. The narrow bandgaps and large nonlinear refractive indices cause strong limitations on the achievable focusing conditions, which in conjunction with important nonlinear propagation effects prevents the high space-time energy localization required for precise and controllable fabrications [3]. Accordingly, there is a strong motivation to monitor and optimize the applied laser conditions inside semiconductors to achieve high-quality 3D fabrication.
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