Si和In0.3Ga0.7As块体mosfet的沟道缩放:蒙特卡罗研究

A. Islam, K. Kalna
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引用次数: 0

摘要

ITRS预测平面CMOS技术的缩放将持续到22 nm[1]技术节点,并且可能的扩展非常诱人[2]。与新颖的非平面技术概念(如多栅极架构或纳米线)相比,继续扩展平面技术的愿望是由更低的成本驱动的[3]。然而,实验证据表明,在非常小的栅长下,载流子的有效迁移率和注入速度将显著降低,从而阻止了达到弹道状态的可能性[4]。
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Channel scaling in Si and In0.3Ga0.7As bulk MOSFETs: A Monte Carlo study
The ITRS predicts that the scaling of planar CMOS technology will continue till the 22 nm [1] technology node and a possible extension is extremely tempting [2]. The desire to continue the scaling of planar technology is driven by lower costs when compared to novel, non-planar technology concepts like multi-gate architectures or nanowires [3]. However, experimental evidence suggests that carrier effective mobility and injection velocity will dramatically lower at very small gate lengths thus prohibiting the possibility of reaching the ballistic regime [4].
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