{"title":"Intel®QuickPath互连概述","authors":"R. Safranek","doi":"10.1109/HOTCHIPS.2009.7478336","DOIUrl":null,"url":null,"abstract":"Presents a collection of slides covering the following topics: Intel QuickPath Interconnect; platform configuration; physical layer; link pair; transmitter discrete-time linear equalizer; coefficient search; link layer; virtual channel mapping function; message class; command insert interleave; routing layer; protocol layer; and configuration agent.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"9 1","pages":"1-27"},"PeriodicalIF":0.0000,"publicationDate":"2009-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Intel® QuickPath interconnect overview\",\"authors\":\"R. Safranek\",\"doi\":\"10.1109/HOTCHIPS.2009.7478336\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Presents a collection of slides covering the following topics: Intel QuickPath Interconnect; platform configuration; physical layer; link pair; transmitter discrete-time linear equalizer; coefficient search; link layer; virtual channel mapping function; message class; command insert interleave; routing layer; protocol layer; and configuration agent.\",\"PeriodicalId\":6666,\"journal\":{\"name\":\"2015 IEEE Hot Chips 27 Symposium (HCS)\",\"volume\":\"9 1\",\"pages\":\"1-27\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE Hot Chips 27 Symposium (HCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HOTCHIPS.2009.7478336\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE Hot Chips 27 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2009.7478336","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
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