利用热响应4D打印技术制备弯曲模压互连器件的研究

{"title":"利用热响应4D打印技术制备弯曲模压互连器件的研究","authors":"Ju-Yeon Lee, Min-Jong Lee, Y. Son, Jeong-Hun Yoon, Keun Park","doi":"10.3795/ksme-a.2023.47.3.229","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":23293,"journal":{"name":"Transactions of The Korean Society of Mechanical Engineers A","volume":null,"pages":null},"PeriodicalIF":0.2000,"publicationDate":"2023-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Study on Fabrication of Curved Molded-Interconnect Device Using Thermoresponsive 4D Printing\",\"authors\":\"Ju-Yeon Lee, Min-Jong Lee, Y. Son, Jeong-Hun Yoon, Keun Park\",\"doi\":\"10.3795/ksme-a.2023.47.3.229\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":23293,\"journal\":{\"name\":\"Transactions of The Korean Society of Mechanical Engineers A\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.2000,\"publicationDate\":\"2023-03-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Transactions of The Korean Society of Mechanical Engineers A\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.3795/ksme-a.2023.47.3.229\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of The Korean Society of Mechanical Engineers A","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3795/ksme-a.2023.47.3.229","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}