{"title":"资源与材料技术的最新进展。新一代半导体布线用铜配合物的评价及铜膜的制备。","authors":"A. Sai","doi":"10.2473/SHIGENTOSOZAI.113.510","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":22754,"journal":{"name":"The Mining and Materials Processing Institute of Japan","volume":"122 1","pages":"510-513"},"PeriodicalIF":0.0000,"publicationDate":"1997-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Recent advance in the resources and material technology. Evaluation of a new Cu complex for the next generation semiconductor wiring and preparation of a Cu film.\",\"authors\":\"A. Sai\",\"doi\":\"10.2473/SHIGENTOSOZAI.113.510\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":22754,\"journal\":{\"name\":\"The Mining and Materials Processing Institute of Japan\",\"volume\":\"122 1\",\"pages\":\"510-513\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Mining and Materials Processing Institute of Japan\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2473/SHIGENTOSOZAI.113.510\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Mining and Materials Processing Institute of Japan","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2473/SHIGENTOSOZAI.113.510","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Recent advance in the resources and material technology. Evaluation of a new Cu complex for the next generation semiconductor wiring and preparation of a Cu film.