高击穿电压(> 1000 V)下圆形β- ga2o3 mosfet的特性

K. Cho, J. Mun, Woojin Chang, Hyun-Wook Jung
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引用次数: 0

摘要

在这项研究中,证明了在掺硅、mbe生长的β-Ga2O3上制备的mosfet。采用分子束外延(MBE)技术,在掺铁、半绝缘的1.5 cm × 1 cm Ga2O3衬底上生长出掺硅的Ga2O3外延层。所制器件为栅极长度为3 μm、源漏间距为20 μm、栅极宽度为523 μm的圆形mosfet。该器件具有良好的掐断特性、约2.7×10的高通断漏流比和1080 V的高击穿电压,证明了Ga2O3在电力器件中的应用潜力,包括电动汽车、铁路和可再生能源。
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Characteristics of Circular β-Ga 2 O 3 MOSFETs with High Breakdown Voltage (>1,000 V)
In this study, MOSFETs fabricated on Si-doped, MBE-grown β-Ga2O3 are demonstrated. A Si-doped Ga2O3 epitaxial layer was grown on a Fe-doped, semi-insulating 1.5 cm × 1 cm Ga2O3 substrate using molecular beam epitaxy (MBE). The fabricated devices are circular type MOSFETs with a gate length of 3 μm, a source-drain spacing of 20 μm, and a gate width of 523 μm. The device exhibited a good pinch-off characteristic, a high on-off drain current ratio of approximately 2.7×10, and a high breakdown voltage of 1,080 V, which demonstrates the potential of Ga2O3 for power device applications including electric vehicles, railways, and renewable energy.
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