Bonseyes AI pipeline——将AI带给你

IF 3.5 Q2 COMPUTER SCIENCE, INFORMATION SYSTEMS ACM Transactions on Internet of Things Pub Date : 2019-01-15 DOI:10.1145/3403572
Miguel de Prado, Jing Su, Rabia Saeed, Lorenzo Keller, Noelia Vállez, Andrew Anderson, David Gregg, L. Benini, Tim Llewellynn, N. Ouerhani, Rozenn Dahyot, Nuria Pazos
{"title":"Bonseyes AI pipeline——将AI带给你","authors":"Miguel de Prado, Jing Su, Rabia Saeed, Lorenzo Keller, Noelia Vállez, Andrew Anderson, David Gregg, L. Benini, Tim Llewellynn, N. Ouerhani, Rozenn Dahyot, Nuria Pazos","doi":"10.1145/3403572","DOIUrl":null,"url":null,"abstract":"Next generation of embedded Information and Communication Technology (ICT) systems are interconnected and collaborative systems able to perform autonomous tasks. The remarkable expansion of the embedded ICT market, together with the rise and breakthroughs of Artificial Intelligence (AI), have put the focus on the Edge as it stands as one of the keys for the next technological revolution: the seamless integration of AI in our daily life. However, training and deployment of custom AI solutions on embedded devices require a fine-grained integration of data, algorithms, and tools to achieve high accuracy and overcome functional and non-functional requirements. Such integration requires a high level of expertise that becomes a real bottleneck for small and medium enterprises wanting to deploy AI solutions on the Edge, which, ultimately, slows down the adoption of AI on applications in our daily life. In this work, we present a modular AI pipeline as an integrating framework to bring data, algorithms, and deployment tools together. By removing the integration barriers and lowering the required expertise, we can interconnect the different stages of particular tools and provide a modular end-to-end development of AI products for embedded devices. Our AI pipeline consists of four modular main steps: (i) data ingestion, (ii) model training, (iii) deployment optimization, and (iv) the IoT hub integration. To show the effectiveness of our pipeline, we provide examples of different AI applications during each of the steps. Besides, we integrate our deployment framework, Low-Power Deep Neural Network (LPDNN), into the AI pipeline and present its lightweight architecture and deployment capabilities for embedded devices. Finally, we demonstrate the results of the AI pipeline by showing the deployment of several AI applications such as keyword spotting, image classification, and object detection on a set of well-known embedded platforms, where LPDNN consistently outperforms all other popular deployment frameworks.","PeriodicalId":29764,"journal":{"name":"ACM Transactions on Internet of Things","volume":"23 1","pages":"1 - 25"},"PeriodicalIF":3.5000,"publicationDate":"2019-01-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Bonseyes AI Pipeline—Bringing AI to You\",\"authors\":\"Miguel de Prado, Jing Su, Rabia Saeed, Lorenzo Keller, Noelia Vállez, Andrew Anderson, David Gregg, L. Benini, Tim Llewellynn, N. Ouerhani, Rozenn Dahyot, Nuria Pazos\",\"doi\":\"10.1145/3403572\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Next generation of embedded Information and Communication Technology (ICT) systems are interconnected and collaborative systems able to perform autonomous tasks. The remarkable expansion of the embedded ICT market, together with the rise and breakthroughs of Artificial Intelligence (AI), have put the focus on the Edge as it stands as one of the keys for the next technological revolution: the seamless integration of AI in our daily life. However, training and deployment of custom AI solutions on embedded devices require a fine-grained integration of data, algorithms, and tools to achieve high accuracy and overcome functional and non-functional requirements. Such integration requires a high level of expertise that becomes a real bottleneck for small and medium enterprises wanting to deploy AI solutions on the Edge, which, ultimately, slows down the adoption of AI on applications in our daily life. In this work, we present a modular AI pipeline as an integrating framework to bring data, algorithms, and deployment tools together. By removing the integration barriers and lowering the required expertise, we can interconnect the different stages of particular tools and provide a modular end-to-end development of AI products for embedded devices. Our AI pipeline consists of four modular main steps: (i) data ingestion, (ii) model training, (iii) deployment optimization, and (iv) the IoT hub integration. To show the effectiveness of our pipeline, we provide examples of different AI applications during each of the steps. Besides, we integrate our deployment framework, Low-Power Deep Neural Network (LPDNN), into the AI pipeline and present its lightweight architecture and deployment capabilities for embedded devices. Finally, we demonstrate the results of the AI pipeline by showing the deployment of several AI applications such as keyword spotting, image classification, and object detection on a set of well-known embedded platforms, where LPDNN consistently outperforms all other popular deployment frameworks.\",\"PeriodicalId\":29764,\"journal\":{\"name\":\"ACM Transactions on Internet of Things\",\"volume\":\"23 1\",\"pages\":\"1 - 25\"},\"PeriodicalIF\":3.5000,\"publicationDate\":\"2019-01-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACM Transactions on Internet of Things\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/3403572\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, INFORMATION SYSTEMS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACM Transactions on Internet of Things","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3403572","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, INFORMATION SYSTEMS","Score":null,"Total":0}
引用次数: 5

摘要

下一代嵌入式信息和通信技术(ICT)系统是能够执行自主任务的互连和协作系统。嵌入式信息通信技术市场的显著扩张,以及人工智能(AI)的兴起和突破,使边缘成为下一场技术革命的关键之一:将人工智能无缝融入我们的日常生活。然而,在嵌入式设备上培训和部署定制人工智能解决方案需要对数据、算法和工具进行细粒度集成,以实现高精度,并克服功能性和非功能性需求。这种集成需要高水平的专业知识,这对于想要在边缘部署人工智能解决方案的中小型企业来说是一个真正的瓶颈,这最终会减缓人工智能在我们日常生活中应用程序的采用。在这项工作中,我们提出了一个模块化的人工智能管道作为一个集成框架,将数据、算法和部署工具结合在一起。通过消除集成障碍和降低所需的专业知识,我们可以将特定工具的不同阶段互连起来,并为嵌入式设备提供AI产品的模块化端到端开发。我们的人工智能管道包括四个模块化的主要步骤:(i)数据摄取,(ii)模型训练,(iii)部署优化,以及(iv)物联网中心集成。为了显示流水线的有效性,我们在每个步骤中提供了不同AI应用程序的示例。此外,我们将我们的部署框架低功耗深度神经网络(LPDNN)集成到人工智能管道中,并展示了其轻量级架构和嵌入式设备的部署能力。最后,我们通过展示在一组知名的嵌入式平台上部署几个AI应用程序(如关键字识别、图像分类和对象检测)来展示AI管道的结果,其中LPDNN始终优于所有其他流行的部署框架。
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Bonseyes AI Pipeline—Bringing AI to You
Next generation of embedded Information and Communication Technology (ICT) systems are interconnected and collaborative systems able to perform autonomous tasks. The remarkable expansion of the embedded ICT market, together with the rise and breakthroughs of Artificial Intelligence (AI), have put the focus on the Edge as it stands as one of the keys for the next technological revolution: the seamless integration of AI in our daily life. However, training and deployment of custom AI solutions on embedded devices require a fine-grained integration of data, algorithms, and tools to achieve high accuracy and overcome functional and non-functional requirements. Such integration requires a high level of expertise that becomes a real bottleneck for small and medium enterprises wanting to deploy AI solutions on the Edge, which, ultimately, slows down the adoption of AI on applications in our daily life. In this work, we present a modular AI pipeline as an integrating framework to bring data, algorithms, and deployment tools together. By removing the integration barriers and lowering the required expertise, we can interconnect the different stages of particular tools and provide a modular end-to-end development of AI products for embedded devices. Our AI pipeline consists of four modular main steps: (i) data ingestion, (ii) model training, (iii) deployment optimization, and (iv) the IoT hub integration. To show the effectiveness of our pipeline, we provide examples of different AI applications during each of the steps. Besides, we integrate our deployment framework, Low-Power Deep Neural Network (LPDNN), into the AI pipeline and present its lightweight architecture and deployment capabilities for embedded devices. Finally, we demonstrate the results of the AI pipeline by showing the deployment of several AI applications such as keyword spotting, image classification, and object detection on a set of well-known embedded platforms, where LPDNN consistently outperforms all other popular deployment frameworks.
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来源期刊
CiteScore
5.20
自引率
3.70%
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0
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