{"title":"垂直堆叠可重构计算机的体系结构","authors":"D.S. Stevenson, R. O. Conn","doi":"10.1109/HPRCTA.2008.4745678","DOIUrl":null,"url":null,"abstract":"This paper describes a scalable reconfigurable computing system using a Silicon circuit board (SiCB) design approach. The design involves attachment of unpackaged FPGA and memory die to wafer scale silicon substrates. The resulting reconfigurable computing system has substantial density, cost, and power consumption and performance improvements relative to other known integration or construction methods. A description of the SiCB technology and detailed advantages are provided. In addition, the reconfigurable computer architecture resulting from the use of SiCBs is described.","PeriodicalId":59014,"journal":{"name":"高性能计算技术","volume":"43 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2008-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Architecture of a vertically stacked reconfigurable computer\",\"authors\":\"D.S. Stevenson, R. O. Conn\",\"doi\":\"10.1109/HPRCTA.2008.4745678\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a scalable reconfigurable computing system using a Silicon circuit board (SiCB) design approach. The design involves attachment of unpackaged FPGA and memory die to wafer scale silicon substrates. The resulting reconfigurable computing system has substantial density, cost, and power consumption and performance improvements relative to other known integration or construction methods. A description of the SiCB technology and detailed advantages are provided. In addition, the reconfigurable computer architecture resulting from the use of SiCBs is described.\",\"PeriodicalId\":59014,\"journal\":{\"name\":\"高性能计算技术\",\"volume\":\"43 1\",\"pages\":\"1-6\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"高性能计算技术\",\"FirstCategoryId\":\"1093\",\"ListUrlMain\":\"https://doi.org/10.1109/HPRCTA.2008.4745678\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"高性能计算技术","FirstCategoryId":"1093","ListUrlMain":"https://doi.org/10.1109/HPRCTA.2008.4745678","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Architecture of a vertically stacked reconfigurable computer
This paper describes a scalable reconfigurable computing system using a Silicon circuit board (SiCB) design approach. The design involves attachment of unpackaged FPGA and memory die to wafer scale silicon substrates. The resulting reconfigurable computing system has substantial density, cost, and power consumption and performance improvements relative to other known integration or construction methods. A description of the SiCB technology and detailed advantages are provided. In addition, the reconfigurable computer architecture resulting from the use of SiCBs is described.