Lan‐Lan Zhu, Shengfa Liu, W. Xiong, J. Xiong, Zhebing Hu, Chen Chen
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Preparation, Microstructure and Properties of Environmentally Friendly Sn-58Bi Eutectic Solder Ribbon for Electronic Package
Sn-58Bi eutectic solder ribbon was successfully prepared using an improved single-roller rapid solidification device with the optimum process parameters. The microstructure, melting behavior and wettability of Sn-58Bi eutectic solder ribbon prepared by rapid solidification technology (RST) and conventional casting-rolling process (CRP) respectively were investigated by optical microscopy (OM), differential scanning calorimetry (DSC) and wettability tests. The results show that the forming effect of solder ribbons can be obviously improved by mainly optimizing roller line speed, nozzle-to-roller spacing and heating temperature. Sn-58Bi eutectic solder ribbon prepared by RST has finer microstructure, lower solidus temperature and more excellent wettability than that of the ribbon prepared by CRP. Therefore, the study of Sn-58Bi eutectic solder ribbon is conducive to cut cost, meet growing performance requirements, and reduce lead contamination for electronic package industry.
期刊介绍：
The international Journal of Residuals Science & Technology (JRST) is a blind-refereed quarterly devoted to conscientious analysis and commentary regarding significant environmental sciences-oriented research and technical management of residuals in the environment. The journal provides a forum for scientific investigations addressing contamination within environmental media of air, water, soil, and biota and also offers studies exploring source, fate, transport, and ecological effects of environmental contamination.
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