汞光敏化化学气相沉积非晶氢化氮化硅的光电应用

P. Pastorino, G. Morello, S. Tamagno
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摘要

本文主要研究了利用sih4和nh3汞敏化光化学气相沉积法(photocvd)制备的非晶氢化氮化硅(a-SiN:H)薄膜的性能及其在III-V型半导体光电器件(介电绝缘、反向结保护、工艺掩膜、选择性再生、增透涂层)中的适用性。在适当的沉积条件下,我们得到了击穿场8.9 MV/cm、介电性能空间均匀性好的a-SiN:H薄膜,在1535 nm处折射率为1.85、准化学计量成分(Si/N=0.8)、能隙4.22 eV、密度2.51 g/ cm3、无孔隙和气泡。我们可以在±3%、±0.005和0.05 eV范围内再现薄膜厚度、折射率和能隙。为了测试生长在垂直表面上的a-SiN:H薄膜的机械附着力和厚度,采用了与实际光电器件相似的SiN/InP结构。在优化条件下沉积的A-SiN:H薄膜已成功应用于上述应用中。
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Amorphous Hydrogenated Silicon Nitride Deposited by Mercury Photosensitization Chemical Vapour Deposition for Optoelectronic Applications
In this work we focus on the properties of amorphous hydrogenated silicon nitride (a-SiN:H) films deposited by mercury sensitization Photo-Chemical Vapour Deposition (Photo-CVD) utilizing SiH 4 and NH 3 and their suitability for the realization of III-V semiconductor optoelectronic devices (dielectric insulation, protection of reverse junctions, process mask, selective regrowth, antireflection coating). Using proper deposition conditions we have obtained a-SiN:H films with breakdown field of 8.9 MV/cm, good spatial uniformity of the dielectric properties, refractive index of 1.85 at 1535 nm, quasi-stoichiometric composition (Si/N=0.8), energy gap of 4.22 eV and density of 2.51 g/cm 3 , absence of pores and bubbles. We can reproduce film thickness, refractive index and energy gap within ±3%, ±0.005 and 0.05 eV respectively. SiN/InP structures similar to the actual optoelectronic devices have been employed in order to test mechanical adhesion and thichness of the a-SiN:H film grown on vertical facets. A-SiN:H films deposited in the optimized conditions have been successfully used in the previously mentioned applications.
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