{"title":"塑料上自组装的硅网络","authors":"S.A. Stauth, B. Parviz","doi":"10.1109/SENSOR.2005.1496615","DOIUrl":null,"url":null,"abstract":"We demonstrate the use of self-assembly for low temperature integration of microfabricated silicon components on a plastic substrate. Our method allows for integration of parts made by incompatible microfabrication technologies into a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connections. The mild self-assembly conditions (temperature <100 C, pH /spl sim/3.5) are compatible with most electronics and photonics components.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"44 1","pages":"964-967 Vol. 1"},"PeriodicalIF":0.0000,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"Self-assembled silicon networks on plastic\",\"authors\":\"S.A. Stauth, B. Parviz\",\"doi\":\"10.1109/SENSOR.2005.1496615\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We demonstrate the use of self-assembly for low temperature integration of microfabricated silicon components on a plastic substrate. Our method allows for integration of parts made by incompatible microfabrication technologies into a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connections. The mild self-assembly conditions (temperature <100 C, pH /spl sim/3.5) are compatible with most electronics and photonics components.\",\"PeriodicalId\":22359,\"journal\":{\"name\":\"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.\",\"volume\":\"44 1\",\"pages\":\"964-967 Vol. 1\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-06-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SENSOR.2005.1496615\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SENSOR.2005.1496615","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We demonstrate the use of self-assembly for low temperature integration of microfabricated silicon components on a plastic substrate. Our method allows for integration of parts made by incompatible microfabrication technologies into a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connections. The mild self-assembly conditions (temperature <100 C, pH /spl sim/3.5) are compatible with most electronics and photonics components.
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