高温下瓷砖拼装系统的性能研究

S. Seki, Y. Okuno
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引用次数: 7

摘要

Winfree的瓷砖组装系统(TASs)在高温下的行为与称为阈值编程的特定形式的整数规划相结合进行了研究。首先,我们提出了一种从布尔可满足性问题($\ensuremath{\mbox{\rm S{\scriptsize AT}}}$)到阈值编程以及进一步到TAS行为的桥梁的方法,以证明优化以给定方式作为输入的TASs的温度的np硬度。这些桥将使我们进一步得到关于高温下TASs行为的两个重要结果。第一种说法是,需要任意高的温度来组装“合理”尺寸的TAS的某些形状。其次,对于任何给定的温度τ≥4,要找到自组装给定形状并在低于τ的温度下工作的最小尺寸TAS是np困难的。
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On the Behavior of Tile Assembly System at High Temperatures
Behaviors of Winfree's tile assembly systems (TASs) at high temperatures are investigated in combination with integer programming of a specific form called threshold programming. First, we propose a way to build bridges from the Boolean satisfiability problem ($\ensuremath{\mbox{\rm S{\scriptsize AT}}}$) to threshold programming, and further to TAS's behavior, in order to prove the NP-hardness of optimizing temperatures of TASs that behave in a way given as input. These bridges will take us further to two important results on the behavior of TASs at high temperatures. The first says that arbitrarily high temperatures are required to assemble some shape by a TAS of "reasonable" size. The second is that for any temperature τ≥4 given as a parameter, it is NP-hard to find the minimum size TAS that self-assembles a given shape and works at a temperature below τ.
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