溴化银原位处理Cu(InGa)Se2半导体薄膜的再结晶研究

Deewakar Poudel, T. Lepetit, Benjamin Belfore, Elizabeth Palmiotti, T. Ashrafee, S. Karki, G. Rajan, A. Rockett, N. Barreau, S. Marsillac
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引用次数: 7

摘要

采用三段低温钼背接触热共蒸发法制备Cu(In,Ga)Se2样品。再结晶过程在第二和第三阶段之间通过闪烁25mg AgBr 2分钟进行。XRD和SEM检测证实了小晶粒转变为大晶粒的形貌结构变化。SIMS深度剖面中Ga梯度的减小表明,AgBr处理导致Ga相互扩散。总的来说,与沉积的器件相比,AgBr处理有助于器件性能的总体改善。
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Studying the Recrystallization of Cu(InGa)Se2 Semiconductor Thin Films by Silver Bromide In-situ Treatment
Cu(In,Ga)Se2 samples were fabricated using a 3-stage thermal co-evaporation process on molybdenum back contact at low temperature. The process of recrystallization was carried out in between the 2nd and 3rd stages by flashing 25 mg of AgBr for 2 minutes. A change in morphological structure was observed as small grains transformed into large grains, as confirmed by XRD and SEM measurements. The decrease of the Ga gradient, seen in the SIMS depth profile, suggests Ga interdiffusion due to AgBr treatment. Overall, the AgBr treatment contributes to a general improvement in device performance as compared to the as-deposited devices.
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