欢迎各位来宾

2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2013-08-01 DOI:10.1109/HOTCHIPS.2013.7478282

K. Asanović, J. V. D. Waerdt

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引用次数: 0

摘要

8月底即将到来，我们即将开始为期三天的HotChips会议:工业界和学术界联系的会议。去年，我们在德安扎学院的“弗林特中心”(Flint Center)进行了非现场演讲，今年我们又回到了老地点:斯坦福大学的“纪念礼堂”(Memorial Auditorium)。像往年一样，今年的会议为您提供了一天的教程和两天的主题演讲和常规演讲。

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Welcome from general chairs

End of August is upon us and we are about to embark upon three days of HotChips: the conference where industry and academia connect. After last year's off-site at the “Flint Center” at De Anza College, we are back at our regular location: “Memorial Auditorium” at Stanford University. Like most years, this year's conference provides you with one day of tutorials and two days of keynote and regular presentations.

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2015 IEEE Hot Chips 27 Symposium (HCS)

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