收缩电路:电子电路的草图、收缩和成形

Joanne Lo, E. Paulos
{"title":"收缩电路:电子电路的草图、收缩和成形","authors":"Joanne Lo, E. Paulos","doi":"10.1145/2642918.2647421","DOIUrl":null,"url":null,"abstract":"In this paper we describe the development of ShrinkyCircuits, a novel electronic prototyping technique that captures the flexibility of sketching and leverages properties of a common everyday plastic polymer to enable low-cost, miniature, planar, and curved, multi-layer circuit designs in minutes. ShrinkyCircuits take advantage of inexpensive prestressed polymer film that shrinks to its original size when exposed to heat. This enables improved electrical characteristics though sintering of the conductive electrical layer, partial self-assembly of the circuit and components, and mechanically robust custom shapes Including curves and non-planar form factors. We demonstrate the range and adaptability of ShrinkyCircuits designs from simple hand drawn circuits with through-hole components to complex multilayer, printed circuit boards (PCB), with curved and irregular shaped electronic layouts and surface mount components. Our approach enables users to create extremely customized circuit boards with dense circuit layouts while avoiding messy chemical etching, expensive board milling machines, or time consuming delays in using outside PCB production houses.","PeriodicalId":20543,"journal":{"name":"Proceedings of the 27th annual ACM symposium on User interface software and technology","volume":"60 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2014-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"32","resultStr":"{\"title\":\"ShrinkyCircuits: sketching, shrinking, and formgiving for electronic circuits\",\"authors\":\"Joanne Lo, E. Paulos\",\"doi\":\"10.1145/2642918.2647421\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper we describe the development of ShrinkyCircuits, a novel electronic prototyping technique that captures the flexibility of sketching and leverages properties of a common everyday plastic polymer to enable low-cost, miniature, planar, and curved, multi-layer circuit designs in minutes. ShrinkyCircuits take advantage of inexpensive prestressed polymer film that shrinks to its original size when exposed to heat. This enables improved electrical characteristics though sintering of the conductive electrical layer, partial self-assembly of the circuit and components, and mechanically robust custom shapes Including curves and non-planar form factors. We demonstrate the range and adaptability of ShrinkyCircuits designs from simple hand drawn circuits with through-hole components to complex multilayer, printed circuit boards (PCB), with curved and irregular shaped electronic layouts and surface mount components. Our approach enables users to create extremely customized circuit boards with dense circuit layouts while avoiding messy chemical etching, expensive board milling machines, or time consuming delays in using outside PCB production houses.\",\"PeriodicalId\":20543,\"journal\":{\"name\":\"Proceedings of the 27th annual ACM symposium on User interface software and technology\",\"volume\":\"60 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-10-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"32\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 27th annual ACM symposium on User interface software and technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/2642918.2647421\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 27th annual ACM symposium on User interface software and technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2642918.2647421","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 32

摘要

在本文中,我们描述了ShrinkyCircuits的发展,这是一种新颖的电子原型技术,它捕捉了草图的灵活性,并利用了普通日常塑料聚合物的特性,在几分钟内实现了低成本、微型、平面和弯曲的多层电路设计。收缩电路利用廉价的预应力聚合物薄膜,当暴露在热收缩到原来的尺寸。通过导电层的烧结,电路和元件的部分自组装,以及包括曲线和非平面形状因素在内的机械坚固的定制形状,这使得电气特性得到改善。我们展示了缩水电路设计的范围和适应性,从简单的手绘电路与通孔元件到复杂的多层印刷电路板(PCB),具有弯曲和不规则形状的电子布局和表面贴装元件。我们的方法使用户能够创建具有密集电路布局的极其定制的电路板,同时避免混乱的化学蚀刻,昂贵的板铣床,或在使用外部PCB生产车间时耗时的延迟。
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ShrinkyCircuits: sketching, shrinking, and formgiving for electronic circuits
In this paper we describe the development of ShrinkyCircuits, a novel electronic prototyping technique that captures the flexibility of sketching and leverages properties of a common everyday plastic polymer to enable low-cost, miniature, planar, and curved, multi-layer circuit designs in minutes. ShrinkyCircuits take advantage of inexpensive prestressed polymer film that shrinks to its original size when exposed to heat. This enables improved electrical characteristics though sintering of the conductive electrical layer, partial self-assembly of the circuit and components, and mechanically robust custom shapes Including curves and non-planar form factors. We demonstrate the range and adaptability of ShrinkyCircuits designs from simple hand drawn circuits with through-hole components to complex multilayer, printed circuit boards (PCB), with curved and irregular shaped electronic layouts and surface mount components. Our approach enables users to create extremely customized circuit boards with dense circuit layouts while avoiding messy chemical etching, expensive board milling machines, or time consuming delays in using outside PCB production houses.
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