N. Bhushan, T. Ji, O. Koymen, J. E. Smee, J. Soriaga, Sundar Subramanian, Yongbin Wei
{"title":"行业角度来看","authors":"N. Bhushan, T. Ji, O. Koymen, J. E. Smee, J. Soriaga, Sundar Subramanian, Yongbin Wei","doi":"10.1109/MWC.2017.8088414","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":13497,"journal":{"name":"IEEE Wirel. Commun.","volume":"15 1","pages":"6-8"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"132","resultStr":"{\"title\":\"Industry Perspective\",\"authors\":\"N. Bhushan, T. Ji, O. Koymen, J. E. Smee, J. Soriaga, Sundar Subramanian, Yongbin Wei\",\"doi\":\"10.1109/MWC.2017.8088414\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":13497,\"journal\":{\"name\":\"IEEE Wirel. Commun.\",\"volume\":\"15 1\",\"pages\":\"6-8\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"132\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Wirel. Commun.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWC.2017.8088414\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Wirel. Commun.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWC.2017.8088414","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}