计算机控制“注入- lpcvd”沉积氧化层

F. Felten, J. Sénateur, F. Weiss, R. Madar, A. Abrutis
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引用次数: 6

摘要

实验了一种稳定生成CVD薄层前驱体蒸汽压的新工艺。蒸汽压力由连续的计算机驱动注入精确的微量液体在蒸发器中控制,在蒸发器中发生闪蒸。在沉积过程中,前驱体在惰性气体的室温下保持在密封容器中,甚至可以使用热不稳定的前驱体。本文报道的结果主要集中在Ta 2o5的OMCVD沉积。在650℃时(非晶层),生长速率增大到11 μm/h,在650℃以上(结晶层),生长速率减小。在第二部分中,我们展示了使用两个注入剂制备t2o5 / sio2多层膜的可行性。
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Deposition of oxide layers by computer controlled 'injection-LPCVD'
A new process for stable generation of precursor's vapour pressure for CVD thin layers synthesis is experimented. The vapour pressure is controlled by sequential computer-driven injection of precise micro amounts of liquid in an evaporator, where flash volatilization occurs. During deposition, the precursors are maintained at room temperature under inert gases in an hermetically closed vessel: even thermally unstable precursors may be used. The results reported here are focused on the OMCVD deposition of Ta 2 O 5 . The growth rate increases up to 11 μm/h at 650°C (amorphous layers), and decreases above (crystallized layers). In a second part, we demonstrate the feasibility of Ta 2 O 5 /SiO 2 multilayers using two injectors.
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