热压成型技术在聚合物加工中的发展与应用综述

S. Jingyao, Zhuang Jian, Ying Liu, Hong Xu, Jesse Horne, Evan K. Wujcik, Haichao Liu, J. Ryu, Daming Wu, Zhanhu Guo
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引用次数: 29

摘要

聚合物材料的热压印技术是一种有前途的技术,可以在微/纳米尺度上制作高质量和高精度的图案。热压印有三种基本形式,包括板对板(P2P),卷对板(R2P)和卷对卷(R2R)热压印。根据聚合物基材和结构型模具的温控方式不同,也可分为等温热压和非等温热压。本文综述了热压印技术在高分子材料加工中的最新进展,以及为缩短热压印工艺周期而作出的努力。对热压成形过程仿真和模具制造方面的研究与创新进行了全面总结。本文对微流体、导光板和其他热压技术的新应用进行了系统的综述。最后,对聚合物热压加工面临的挑战和未来发展趋势进行了展望。
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Development and Application of Hot Embossing in Polymer Processing: A Review
Hot embossing of polymer materials is a promising technology for the fabrication of high quality and precision patterns on the micro/nano-scales. There are three basic forms of hot embossing including, plate-to-plate (P2P), roll-to-plate (R2P), and roll-to-roll (R2R) hot embossing. It also can be divided into isothermal and non-isothermal hot embossing according to the different temperature control modes of polymer substrates and structured molds. This review reports recent progress made of hot embossing methods in polymer processing and the efforts to shorten its processing period for commercial applications. Research and innovations in simulation of hot embossing process and mold fabrication are also comprehensively summarized. Within this review, microfluidics, light guide plate (LGP), and other novel applications of hot embossing are systematically cataloged. Finally, challenges and future trends of hot embossing in polymer processing are presented and forecasted.
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