UltraScale+ MPSoC和FPGA系列

2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI:10.1109/HOTCHIPS.2015.7477457

V. Boppana, Sagheer Ahmad, I. Ganusov, Vinod Kathail, V. Rajagopalan, Ralph Wittig

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引用次数: 32

摘要

本文由作者在会议上演讲的幻灯片集合组成。Zynq UltraScale+ MPSoC:赛灵思第二代SoC -应用处理，实时，图形，视频，串行连接-电源管理，安全，安全- SDSoC:全系统优化编译器;超越摩尔:架构创新- 3倍CPU性能和4.5倍内存带宽(SoC) - ultrascale +结构:性能提高60%，2.5倍性能/瓦(FPGA) -第三代硅中间体技术(3D IC);2015年6月在TSMC 16FF+上录制- 3D FinFet晶体管的显著功率和性能优势-今天在多种平台上运行的各种软件和系统。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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UltraScale+ MPSoC and FPGA families

This article consists of a collection of slides from the authors' conference presentation. Zynq UltraScale+ MPSoC: 2nd Generation SoC from Xilinx - Applications processing, Real-time, Graphics, Video, Serial connectivity - Power management, Safety, Security - SDSoC: Full system optimizing compiler; More than Moore: Architectural innovation - 3x CPU performance and 4.5x memory bandwidth (SoC) -UltraScale+ fabric: 60% higher performance, 2.5x performance/watt (FPGA) - 3rd generation of silicon interposer technology (3D IC); Taped out in Jun 2015 on TSMC 16FF+ - Significant power and performance benefits with 3D FinFet transistors - Diverse SW and systems running on multiple platforms today.

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2015 IEEE Hot Chips 27 Symposium (HCS)

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