磷酸盐离子对铜在硫酸盐溶液中电化学行为的影响

G. Kılınççeker, B. Yazıcı, A. Yilmaz, M. Erbil
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引用次数: 17

摘要

研究了不同温度(293、313、333和353 K)和不同pH值(pH = 2·1、7·2和12·3)下磷酸根离子对铜在硫酸盐溶液中腐蚀行为的影响。采用三电极电化学技术进行测量,以饱和甘汞电极(SCE)为参考。建立了阳极极化曲线和阴极极化曲线,并由此确定了阳极和阴极的Tafel常数。腐蚀电位是通过将阳极和阴极塔菲尔线额外推至零电流密度点来确定的。结果表明,在pH值为2.1时,无论是单独的硫酸盐溶液还是硫酸盐加磷酸盐溶液,铜的腐蚀速率都有明显的随温度升高而增加的趋势。然而,在pH值为7·2和12·3时,在单独含有硫酸盐和硫酸盐加磷酸盐的溶液中,这种趋势不太明显,最大腐蚀速率大大降低,并且随着温度的升高而增加的趋势不大。提出了阳极和阴极反应机理来解释铜的腐蚀现象。
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Effect of phosphate ions on electrochemical behaviour of copper in sulphate solutions
Abstract The effect of phosphate ions on the corrosion behaviour of copper in sulphate solutions was investigated at different temperatures (293, 313, 333, and 353 K) and at different pH values (pH = 2·1, 7·2, and 12·3). A three electrode electrochemical technique was used for the measurements, using a saturated calomel electrode (SCE) for reference purposes. Both anodic and cathodic polarisation curves were established, from which the anodic and cathodic Tafel constants were determined. Corrosion potentials were determined by extra trapolation of the anodic and cathodic Tafel lines to the point of zero current density. The results showed that for a pH value of 2·1, the corrosion rate of copper showed a marked tendency to increase with increasing temperature in solutions containing either sulphate alone or sulphate plus phosphate. However, at pH values of 7·2 and 12·3, this tendency became less pronounced in solutions containing sulphate alone and in solutions containing sulphate plus phosphate together, max imum corrosion rates were greatly reduced and showed less tendency to increase with increasing temperature. Anodic and cathodic reaction mechanisms are proposed to explain the observations for the corrosion of copper.
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