掺铂n-硅Al - Schottky触点的肖特基势垒参数评价

J. Prabket, W. Itthikusaman, A. Poyai
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引用次数: 1

摘要

在300-420 K的温度范围内,对未掺杂和掺杂铂的NTD n-硅上的铝(Al)肖特基触点进行了电流电压(I-V)和电容电压(C-V)测量。利用I-V和C-V特性提取了二极管的饱和电流、理想因数和肖特基势垒高度。这些参数与硅中铂产生的缺陷水平相关。结果表明,与未掺杂的硅二极管相比,掺铂二极管的饱和电流降低,肖特基势垒高度提高。肖特基势垒高度的高值表明,硅中的铂在能隙中产生供体能级,补偿电子以降低材料的导电性。由于铂掺杂二极管的漏电流比未掺杂器件少,因此作为低损耗整流器的表现更好。
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Evaluation of Schottky barrier parameters of Al Schottky contacts on platinum doped n-silicon
The current-voltage (I-V) and capacitance-voltage (C-V) measurements of Aluminum (Al) Schottky contacts on undoped and platinum-doped NTD n-Silicon were carried out in the temperature range of 300-420 K. The I-V and C-V characteristics were used to extract the saturation current, the ideality factor and the Schottky barrier height of the diodes. These parameters were correlated to the defect levels generated by the Pt in silicon. The results show that the saturation current of Pt doped diode is reduced and the Schottky barrier height of the diode is higher than from that of the diodes fabricated on undoped silicon diodes. This high value of the Schottky barrier height shows that Pt in silicon creates donor levels in the energy gap that compensate electrons to reduce the conductivity of the material. Such the Pt doped diodes have been found to perform better as low loss rectifiers due to there have less leakage current than undoped devices.
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