表面微加工技术中的下一代压力传感器

G. Lammel, S. Armbruster, C. Schelling, H. Benzel, J. Brasas, M. Illing, R. Gampp, V. Senz, F. Schafer, S. Finkbeiner
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引用次数: 20

摘要

最早的MEMS产品之一——压力传感器——仍有创新的空间。我们报道了一种基于新型表面微加工技术的全新压力传感器。使用多孔硅,膜制造可以在模拟/数字半导体工艺中进行单片集成,具有高协同作用,适合ic制造设施中的大批量生产。在标准集成电路工艺开始时,只插入两个掩膜层和一个电化学蚀刻步骤,将外延硅层从电子工艺转变为单晶膜,其下有真空腔。
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Next generation pressure sensors in surface micromachining technology
One of the first MEMS products - the pressure sensor - has still room for innovation. We report a completely new pressure sensor generation based on a novel surface micromachining technology. Using porous silicon the membrane fabrication can be monolithically integrated with high synergy in an analog/digital semiconductor process suited for high volume production in an IC-fabrication facility. Only two mask layers and one electrochemical etching step are inserted at the beginning of a standard IC-process to transform the epitaxial silicon layer from the electronic process into a monocrystalline membrane with a vacuum cavity under it.
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