{"title":"压缩成像在红外半导体失效分析中的应用","authors":"Ting Sun, Gary Woods, K. Kelly","doi":"10.1109/IRMMW-THZ.2011.6105248","DOIUrl":null,"url":null,"abstract":"We present IR emission images obtained from semiconductor devices using compressive sensing mathematics combined with a single-element infrared photon detector as method of defect detection. High signal to noise ratio, robust measurements and fast acquisition have make compressive imaging a strong supplement to traditional IR analysis systems.","PeriodicalId":6353,"journal":{"name":"2011 International Conference on Infrared, Millimeter, and Terahertz Waves","volume":"41 1","pages":"1-1"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Compressive imaging applied to infrared-based semiconductor failure analysis\",\"authors\":\"Ting Sun, Gary Woods, K. Kelly\",\"doi\":\"10.1109/IRMMW-THZ.2011.6105248\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present IR emission images obtained from semiconductor devices using compressive sensing mathematics combined with a single-element infrared photon detector as method of defect detection. High signal to noise ratio, robust measurements and fast acquisition have make compressive imaging a strong supplement to traditional IR analysis systems.\",\"PeriodicalId\":6353,\"journal\":{\"name\":\"2011 International Conference on Infrared, Millimeter, and Terahertz Waves\",\"volume\":\"41 1\",\"pages\":\"1-1\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-12-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 International Conference on Infrared, Millimeter, and Terahertz Waves\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRMMW-THZ.2011.6105248\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Conference on Infrared, Millimeter, and Terahertz Waves","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRMMW-THZ.2011.6105248","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Compressive imaging applied to infrared-based semiconductor failure analysis
We present IR emission images obtained from semiconductor devices using compressive sensing mathematics combined with a single-element infrared photon detector as method of defect detection. High signal to noise ratio, robust measurements and fast acquisition have make compressive imaging a strong supplement to traditional IR analysis systems.
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