用拉曼光谱原位观察掺f硅玻璃的弛豫过程

N. Shimodaira, Kazuya Saito, E. Sekiya, A. Ikushima
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引用次数: 1

摘要

用原位拉曼光谱技术研究了5mol %氟掺杂硅玻璃在初始有效温度为700℃时的结构变化,包括弛豫过程。随着温度的升高,由骨架振动引起的ω 1、ω 3和ω 4波段以各自的方式单调移动,表明Si-O- si键平均角和Si-O键拉伸力常数同时减小。当温度达到tf时,被认为属于三元环结构的d2线强度随温度的升高而稳定增加,而所有基本振动对结构弛豫的进展不敏感。根据d2面积与逆“实际”温度的关系图,d2地层的活化能估计为0.43 eV,这与之前报道的逆“实际”温度估计值非常接近。此外,基于中心力网络模型和Badger定律,估计了ω 4频率变化时Si-O-Si键角的平均变化率约为-0.02°/°C,比依赖于T f时的变化率高出数倍。
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In-situ observation of relaxation process in f-doped silica glass by raman spectroscopy
Structural changes including relaxation process of 5 mol% fluorine doped silica glass with low initial fictive temperature (T f ) of 700°C has been studied by in-situ Raman spectroscopy at temperatures 27 - 1300°C. With increasing temperature, ω 1 , ω 3 and ω 4 bands, attributed to fundamental skeletal vibrations, monotonously shift in their respective ways, suggesting that both the decreases of average Si-O-Si bond angle and Si-O bond stretching force constant simultaneously occur. On reaching T f , intensity of the D 2 line, thought to be attributed to three-membered ring structure, showed a steady increase with increasing temperature, while all the fundamental vibrations were insensitive to the progress of structural relaxation. From the plot of the D 2 area vs. the inverse "actual" temperature, activation energy of the D 2 formation was estimated to be 0.43 eV, which is very close to the previously reported values estimated from the inverse "fictive" temperature. Furthermore, based on the central-force network model and the Badger's law, the change rate of average Si-O-Si bond angle was estimated from shift of ω 4 frequency to be about -0.02°/°C, which is several times higher than that in T f dependence.
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