研究了铝锌基小截面铸钢焊料的组织和性能

K. Nikitin, I. Timoshkin, V. I. Nikitin
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摘要

该研究涵盖了Al-Cu-Si (A34级)和Zn-Al-Cu (Welco52级)焊料。结果表明,A34焊料(Al-28%Cu-6%Si)在较窄的温度范围(~18℃)内熔融结晶。A34焊料的固相温度和液相温度分别为~508°С和~526°С。Zn-Al-Cu (zn - 4% al - 2.5% Cu)焊料具有共晶成分,因此在~389°С恒温下熔化结晶。研究了所研究的焊料在液态和固态下的密度。A34焊料的密度分别为3.02和3.32 g/cm3。液态锌焊料密度为6.28 g/cm3,固态锌焊料密度为6.69 g/cm3。研究了铸造条件对13、10和5 mm2棒状合金组织的影响。焊料合金的主要结构部件的尺寸随着截面的减小而减小。在A34焊料组织中,铝基固溶体枝晶和CuAl2相减少。在锌焊料中,还原最严重的是锌基固溶体枝晶。最好的浇注性是在5mm2的棒材焊料中获得的熔体,所研究的样品间隙为2,0,1,5和1,0 mm。与A34相比,共晶锌焊料具有更好的浇注性:从样品间隙宽度为2,0 mm的5mm2截面锌焊料棒中获得的熔体浇注性为100%(从相同横截面的棒中获得的A34熔体焊料为98%)。焊接AK12合金板和3003合金板的实验表明,焊料/基材系统边界紧密,没有气孔或未焊区等缺陷。焊料合金在基材中有轻微的相互渗透,特别是在焊接AK12铸板时。
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STUDY INTO STRUCTURE AND PROPERTIES OF SOLDERS BASED ON ALUMINUM AND ZINC IN THE FORM OF SMALL-SECTION CAST BARS
The study covers Al–Cu–Si (A34 grade) and Zn–Al–Cu (Welco52 grade) solders. It is found that A34 solder (Al–28%Cu–6%Si) melts and crystallizes in a narrow range of temperatures (~18 °C). Solidus and liquidus temperatures of A34 solder are ~508 °С and ~526 °С, respectively. Zn–Al–Cu (Zn–4%Al–2,5% Cu) solder has a eutectic composition, so it melts and crystallizes at a constant temperature of ~389 °С. Densities of investigated solders in their liquid and solid states are studied. A34 solder has a density of 3,02 and 3,32 g/cm3 , respectively. Zinc solder density is 6,28 g/cm3 in the liquid state, and 6,69 g/cm3 in the solid state. The influence of casting conditions on the structure of cast alloys in the form of bars with cross sections of 13, 10, and 5 mm2 was investigated. Main structural components of solder alloys reduce in size as cross sections decrease. The aluminium-based solid solution dendrites and CuAl2 phase are reduced in the A34 solder microstructure. In zinc solders, the most severely reduced ones are zinc-based solid solution dendrites. The best castability is observed in melts obtained from 5 mm2 section bar solders with studied sample gaps of 2,0, 1,5 and 1,0 mm. Eutectic zinc solder features better castability in comparison with A34: castability of the melt obtained from the 5 mm2 section zinc solder rod with a sample gap width of 2,0 mm is 100 % (for A34 melt solder obtained from a rod of the same cross section it was 98 %). Experiments on soldering AK12 alloy plates and 3003 alloy sheets demonstrated that there is a tight border in the solder/base material system and no any defects such as pores or unsoldered areas. There was a slight interpenetration of solder alloys into base materials, especially when soldering AK12 cast plates.
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