用传递函数检验电子模块抗扰度

Chingchi Chen
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引用次数: 13

摘要

本文利用传递函数来评估电子模块对外部电磁干扰(EMI)的抗扰度,传递函数将外部干扰与模块内部组件所遇到的噪声联系起来。简单的集总电路模型用于描述噪声耦合机制,它们可以通过直接的测试程序进行验证。基于这些简单的模型,确定了主要的耦合机制并验证了减缓效果。该方法用于检查具有免疫缺陷的电子模块。该模块首先在无电源的工作台上进行了研究。然后采取对策并量化效果。然后在功能性车辆上对该组件进行了测试,测量的有效性与台架预测完美匹配。
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Examination of electronic module immunity using transfer functions
In this paper, the immunity of electronic modules to external electromagnetic interference (EMI) was evaluated using transfer functions, which correlate the external disturbances with the noise encountered by the components inside the module. Simple lumped-circuit models are used to describe noise coupling mechanisms, and they can be verified by straight-forward test procedures. Based on these simple models, the dominant coupling mechanisms were identified and mitigation effectiveness verified. This approach was utilized to examine an electronic module with immunity weaknesses. The module was first studied on-bench, at no power. Counter measures were then applied and effectiveness quantified. This component was then tested on a functional vehicle, with measured effectiveness matching on-bench predictions flawlessly.
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