Effect of annealing temperature on subgrain growth during recovery in oxygen-free high conductivity copper

An attempt has been made to study the kinetics of subgrain growth during static recovery in oxygen-free high conductivity copper at two different annealing temperatures. The changes in subgrain sizes were followed in a cold-drawn copper wire as a function of annealing time at 175 and 200°C. A linear relationship between the square D² of the subgrain diameter and the annealing time t has been established at these temperatures. The slopes K of the lines have been found to be 5.4 × 10⁻¹⁸M²s⁻¹ and 7.2 × 10⁻¹⁸m²s⁻¹ at 175°C and 200°C respectively. A large difference between the experimentally observed and theoretically calculated K values has been found.