工业会议

Sukjin Kim, Jason Wong, P. Kane, Dylan Wang, Xiaolong Xie
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引用次数: 1

摘要

赛灵思已经开发出更先进的fpga和第二代soc和3D ic,以保持领先,并提供额外的节点价值,性能,功率和集成。UltraScale架构可扩展到20nm平面到16nm及以上的FinFET (FF)技术,从单片到3D ic。在本次演讲中,我们将研究赛灵思FPGA在前沿应用中的案例,以及UltraScale架构第二代soc的优势和设计工具。Patrick Kane,赛普拉斯(Cypress)摘要:物联网正在发生。最新的标准是低功耗蓝牙(BLE)。这可能是物联网通信的长期答案,也可能不是,但它肯定会成为领先的物联网通信标准。物联网正在发生。最新的标准是低功耗蓝牙(BLE)。这可能是物联网通信的长期答案,也可能不是,但它肯定会成为领先的物联网通信标准。工业会议
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Industrial session
Xilinx has developed even more advanced FPGAs and 2nd generation SoCs and 3D ICs to stay a generation ahead, and deliver an extra node worth of performance, power, and integration. The UltraScale architecture was developed to scale from 20nm planar through 16nm and beyond FinFET (FF) technologies, and from monolithic through 3D ICs. In this talk, we will study the cases about Xilinx FPGA in cutting edge applications, also the advantages of UltraScale architecture 2nd generation SoCs, and design tools. IoT and Wearable Applications Enabled by Bluetooth Low Energy (BLE) Solutions Patrick Kane, Cypress Abstract: The Internet of things is happening right now. The newest standard is Bluetooth Low Energy or BLE. This may or may not be the long term answer to IoT communication, but it is certainly in the race to become the leading IoT communication standard. Industrial Session The Internet of things is happening right now. The newest standard is Bluetooth Low Energy or BLE. This may or may not be the long term answer to IoT communication, but it is certainly in the race to become the leading IoT communication standard. Industrial Session
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