氧化硅中锗纳米晶的偏析诱导形成

O. Y. Nalivaiko, Arcady S. Turtsevich, V. Plebanovich, P. Gaiduk
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摘要

对Si1 - xGex合金沉积初期进行了研究,并阐明了Ge纳米晶的形成机理。结果表明,在Si1 - xGex合金生长层的初始阶段,Si1 - xGex的岛核密度比多晶硅的岛核密度增加了2.5 ~ 3.4倍(分别从1.07⋅1011增加到1.90⋅1011 cm-2和从3.1⋅1010增加到4.3⋅1010 cm-2)。随着诱导期的结束和Si1 - xGex连续层的形成,层的厚度减小到8-10 nm(对于多晶硅,类似层的厚度约为22 nm)。结果表明,SiO2 /Si1 - xGex氧化锋对锗原子的偏析作用和Si1 - xGex薄层氧化过程中通过晶界的氧化作用形成了锗纳米晶。得到了滞后电容特性为1.7 ~ 1.8 V、漏电流密度为1.5⋅10-16 ~ 2.2⋅10-16 A/µm2的锗纳米晶阵列MOS结构。
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Segregation-induced formation of Ge nanocrystals in silicon oxide
The investigation of initial stage of Si1 – xGex alloy deposition and clarification of Ge nanocrystal formation mechanism has been carried out. It was found that at the initial stages of growing layers of Si1 – xGex alloys, the density of island nuclei Si1 – xGex increases by a factor of 2.5–3.4 compared to the density of polycrystalline silicon islands (from 1.07 ⋅ 1011 to 1.90 ⋅ 1011 cm–2 and from 3.1 ⋅ 1010 to 4.3 ⋅ 1010 cm–2 respectively). A decrease in the thickness of the layer corresponding to the end of the induction period and the formation of a continuous Si1 – xGex layer to 8–10 nm (for polycrystalline silicon, the thickness of a similar layer is approximately 22 nm) has been established. It is shown that the Ge nanocrystal formation is occurred by segregationist pushback of Ge atoms by the SiO2 /Si1 – xGex oxidation front and oxidation through grain boundaries during oxidation of Si1 – xGex thin layers, produced by chemical vapor deposition. The MOS structure with array of Ge nanocrystal, which has the hysteresis capacitance characteristics of 1.7–1.8 V and leakage current density from 1.5 ⋅ 10–16 to 2.2 ⋅ 10–16 A/µm2 was obtained.
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