{"title":"硼磷和砷在MOS晶体管中的扩散:二维和三维的模拟和分析","authors":"N. Guenifi, R. Mahamdi, I. Rahmani","doi":"10.1080/10426507.2017.1417304","DOIUrl":null,"url":null,"abstract":"GRAPHICAL ABSTRACT ABSTRACT The article introduces the benefits and application features of Silvaco Technology Computer Aided Design ‘TCAD’ tool to predict the performance of electrical components and their reliability. In this work, in order to improve the electrical parameters of MOS transistor such as, threshold voltage and flat band voltage, we have simulated Phosphorus and Arsenic diffusion profiles in three dimensions before and after thermal annealing in a highly doped polysilicon film using the simulator Silvaco TCAD based on Pearson type IV models. The model takes into account the distribution of vacancy mechanisms and effects related to high concentrations, such as the formation of clusters to study solid solubility limit. The results have been analyzed and discussed in order to extract depth of doping (Phosphorus and Arsenic) and they have been able to optimize the silicon oxide thickness, to reduce the penetration of doping. Based on earlier studies a study of the effect of solubility on these profiles was performed.","PeriodicalId":20043,"journal":{"name":"Phosphorus Sulfur and Silicon and The Related Elements","volume":"71 1","pages":"92 - 97"},"PeriodicalIF":0.0000,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Boron phosphorus and arsenic diffusion in MOS transistors: Simulation and analysis in 2D and 3D\",\"authors\":\"N. Guenifi, R. Mahamdi, I. Rahmani\",\"doi\":\"10.1080/10426507.2017.1417304\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"GRAPHICAL ABSTRACT ABSTRACT The article introduces the benefits and application features of Silvaco Technology Computer Aided Design ‘TCAD’ tool to predict the performance of electrical components and their reliability. In this work, in order to improve the electrical parameters of MOS transistor such as, threshold voltage and flat band voltage, we have simulated Phosphorus and Arsenic diffusion profiles in three dimensions before and after thermal annealing in a highly doped polysilicon film using the simulator Silvaco TCAD based on Pearson type IV models. The model takes into account the distribution of vacancy mechanisms and effects related to high concentrations, such as the formation of clusters to study solid solubility limit. The results have been analyzed and discussed in order to extract depth of doping (Phosphorus and Arsenic) and they have been able to optimize the silicon oxide thickness, to reduce the penetration of doping. Based on earlier studies a study of the effect of solubility on these profiles was performed.\",\"PeriodicalId\":20043,\"journal\":{\"name\":\"Phosphorus Sulfur and Silicon and The Related Elements\",\"volume\":\"71 1\",\"pages\":\"92 - 97\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Phosphorus Sulfur and Silicon and The Related Elements\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1080/10426507.2017.1417304\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Phosphorus Sulfur and Silicon and The Related Elements","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/10426507.2017.1417304","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Boron phosphorus and arsenic diffusion in MOS transistors: Simulation and analysis in 2D and 3D
GRAPHICAL ABSTRACT ABSTRACT The article introduces the benefits and application features of Silvaco Technology Computer Aided Design ‘TCAD’ tool to predict the performance of electrical components and their reliability. In this work, in order to improve the electrical parameters of MOS transistor such as, threshold voltage and flat band voltage, we have simulated Phosphorus and Arsenic diffusion profiles in three dimensions before and after thermal annealing in a highly doped polysilicon film using the simulator Silvaco TCAD based on Pearson type IV models. The model takes into account the distribution of vacancy mechanisms and effects related to high concentrations, such as the formation of clusters to study solid solubility limit. The results have been analyzed and discussed in order to extract depth of doping (Phosphorus and Arsenic) and they have been able to optimize the silicon oxide thickness, to reduce the penetration of doping. Based on earlier studies a study of the effect of solubility on these profiles was performed.